Unlock instant, AI-driven research and patent intelligence for your innovation.

Resin composition for temporary fixing, support tape for substrate transfer, and method for manufacturing electronic device

A resin composition and temporary fixation technology, which is used in semiconductor/solid-state device manufacturing, lamination devices, electronic equipment, etc., can solve the problems of semiconductor wafer warpage, inability to fully support semiconductor wafers, warpage, etc., and achieve The effect of improving operability

Pending Publication Date: 2022-06-07
RESONAC CORPORATION
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the semiconductor wafer used in the grinding process has circuits formed on the surface side, and when the thickness is reduced by grinding, it is easily affected by it and warps
BG tape is a tape material that is easily deformed, so it cannot fully support the thinned semiconductor wafer, and it is easy to warp the semiconductor wafer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for temporary fixing, support tape for substrate transfer, and method for manufacturing electronic device
  • Resin composition for temporary fixing, support tape for substrate transfer, and method for manufacturing electronic device
  • Resin composition for temporary fixing, support tape for substrate transfer, and method for manufacturing electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4、 comparative example 1～3

[0171] [Production of the support belt for substrate transfer]

[0172] The varnishes for forming the temporary fixing material layer were prepared with the compositions shown in Table 1 in parts by mass, respectively. The prepared varnish was applied on a polyimide film (manufactured by DU PONT-TORAY CO., LTD., trade name: 100EN, thickness 25 μm) as a support film, heated and dried at 90° C. for 5 minutes, and heated at 120°C for 5 minutes. The temperature was heated and dried for 5 minutes, whereby a temporary fixing material layer having a thickness of 60 μm was formed. Then, the protective film was bonded on the temporary fixing material layer, and the support tape for board|substrate conveyance which has the structure of a support film, a temporary fixing material layer, and a protective film was obtained.

[0173] [Table 1]

[0174]

[0175] The details of each component described in Table 1 are as follows.

[0176] (thermoplastic resin)

[0177] Acrylic rubber K-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
elastic modulusaaaaaaaaaa
peel strengthaaaaaaaaaa
peel strengthaaaaaaaaaa
Login to View More

Abstract

A temporary fixing resin composition for temporarily fixing a substrate transport support to an organic substrate, the temporary fixing resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler, the temporary fixing resin composition having an elastic modulus of 350-550 MPa at 25 DEG C after being heated at 130 DEG C for 30 minutes and heated at 170 DEG C for 2 hours in the form of a film.

Description

technical field [0001] The present invention relates to a resin composition for temporary fixing, a support tape for substrate conveyance, and a method for producing an electronic device. Background technique [0002] With the multi-functionalization of electronic devices such as smart phones and tablet PCs, a stacked MCP (Multi Chip Package) in which the capacity is increased by stacking semiconductor elements in multiple stages has become widespread. Film-like adhesives are widely used as adhesives for die bonding when mounting semiconductor elements. However, when using the conventional connection method of the semiconductor element by wire bonding, the processing speed of the data is limited, so the operation of the electronic device tends to be slow. In addition, there is an increasing need to keep power consumption low and to be able to use it for a longer period of time without charging, so power saving is also required. From such a viewpoint, in recent years, elect...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/301
CPCH01L21/683C09J7/30C09J2203/326C09J2203/37C09J2301/408C08K3/36C08K9/06C09J2463/00C09J2433/00H01L21/6836C09J7/25C09J7/383C09J11/04C08K9/04C08K3/013B32B7/12B32B17/10018B32B17/10779B32B17/10724B32B37/26H01L2221/68327B32B2457/00B32B2307/748C09J7/35C09J2301/502C09J2301/304C09J5/06C09J11/08C09J2479/086C09J2483/00H01L21/568
Inventor 田中实佳祖父江省吾入泽真治小川纱瑛子
Owner RESONAC CORPORATION