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A low stress and high temperature resistant pressure sensor chip packaging method

A pressure sensor and high temperature resistant technology, which is applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of temperature restriction, lead wire breakage, etc., and achieve the effect of improving reliability, reducing residual stress, and tight connection

Active Publication Date: 2022-07-29
成都倍芯传感技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for chip packaging with low-stress sintering, which does not use wires for bonding, and avoids the use of wires under high temperature vibration. Fracture problem, effectively improve the reliability of the device

Method used

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  • A low stress and high temperature resistant pressure sensor chip packaging method
  • A low stress and high temperature resistant pressure sensor chip packaging method

Examples

Experimental program
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Embodiment 1

[0037] Example 1: see figure 1 and figure 2 shown,

[0038] A low stress and high temperature resistant pressure sensor chip packaging method provided in this embodiment includes the following steps:

[0039] S1, a chip glass layer 8 is arranged between the pressure sensor chip 1 and the base layer 2;

[0040] S2. A hole is arranged on the chip glass layer 8, and a transition metal layer 4 is arranged in the hole;

[0041] S3, the pressure sensor chip 1 and the base layer 2 are sintered through the chip glass layer 8;

[0042] S4. A signal transmission line 3 is arranged on the base layer 2, the signal transmission line 3 runs through the base layer 2, and the transition metal layer 4 is sintered with one end of the signal transmission line 3;

[0043] S5. A transition glass layer 6 is provided between the transition metal layer 4 and the base layer 2 , and the transition metal layer 4 is sintered into the base layer 2 through the transition glass layer 6 .

[0044] The ...

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Abstract

The present invention relates to the technical field of packaging, in particular to a low stress and high temperature resistant pressure sensor chip packaging method, comprising a pressure sensor chip, a base layer and a signal transmission line, the signal transmission line passing through the base layer and the sensor chip The electrode is connected, the signal transmission line is used for signal transmission, and the pressure sensor chip and the base layer are sintered into one. The current packaging method is wire bonding. This packaging method will also cause "gold brittleness" at high temperatures, resulting in the breakage of the gold wire. The vibration resistance performance is very low, so the use temperature and environment are limited. The method is changed to a sintered packaging method, and no wire is used for bonding, which avoids the problem of wire breakage under high temperature vibration, and can effectively improve the reliability of the device.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a low stress and high temperature resistant pressure sensor chip packaging method. Background technique [0002] With the strengthening of my country's industrial strength, the requirements for temperature in pressure measurement are getting higher and higher. Conventional pressure sensor chips cannot withstand high temperature environments. Therefore, high temperature pressure sensors have become a hot research point at present. [0003] At present, the pressure sensor chip is packaged by wire bonding, but the maximum operating temperature of this packaging method is difficult to exceed 125 °C. The phenomenon of "gold brittleness" will also occur at high temperature of wire bonding, resulting in gold wire breakage and low vibration resistance. Therefore, The use temperature and environment are limited, and there are restrictions on the use temperature. Based on this, the pres...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00G01L1/00
CPCB81C1/00269B81C1/00325B81C1/00301G01L1/00
Inventor 肖瑞斌罗进李鹏
Owner 成都倍芯传感技术有限公司