Method for packaging low-stress high-temperature-resistant pressure sensor chip
A pressure sensor and chip packaging technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of temperature control, lead wire breakage, etc., and achieve the effects of improving reliability, reducing residual stress, and tight connection
Active Publication Date: 2022-06-24
成都倍芯传感技术有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for chip packaging with low-stress sintering, which does not use wires for bonding, and avoids the use of wires under high temperature vibration. Fracture problem, effectively improve the reliability of the device
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Embodiment 1
[0037] Example 1: see figure 1 and figure 2 shown,
[0038] A low stress and high temperature resistant pressure sensor chip packaging method provided in this embodiment includes the following steps:
[0039] S1, a chip glass layer 8 is arranged between the pressure sensor chip 1 and the base layer 2;
[0040] S2. A hole is arranged on the chip glass layer 8, and a transition metal layer 4 is arranged in the hole;
[0041] S3, the pressure sensor chip 1 and the base layer 2 are sintered through the chip glass layer 8;
[0042] S4. A signal transmission line 3 is arranged on the base layer 2, the signal transmission line 3 runs through the base layer 2, and the transition metal layer 4 is sintered with one end of the signal transmission line 3;
[0043] S5. A transition glass layer 6 is provided between the transition metal layer 4 and the base layer 2 , and the transition metal layer 4 is sintered into the base layer 2 through the transition glass layer 6 .
[0044] The ...
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The invention relates to the technical field of packaging, in particular to a low-stress high-temperature-resistant pressure sensor chip packaging method, which comprises a pressure sensor chip, a base layer and a signal transmission line, and is characterized in that the signal transmission line penetrates through the base layer to be connected with an electrode of the sensor chip and is used for signal transmission; and the pressure sensor chip and the base layer are sintered into a whole. An existing packaging mode is a lead bonding mode, a gold brittleness phenomenon also occurs at a high temperature to cause gold thread breakage and low vibration resistance, so that the use temperature and the environment are limited, the lead bonding packaging mode is changed into a sintering packaging mode, a lead is not used for bonding, and the cost is reduced. The problem of lead breakage under high-temperature vibration is avoided, and the reliability of the device can be effectively improved.
Description
technical field [0001] The invention relates to the technical field of packaging, in particular to a low stress and high temperature resistant pressure sensor chip packaging method. Background technique [0002] With the strengthening of my country's industrial strength, the requirements for temperature in pressure measurement are getting higher and higher. Conventional pressure sensor chips cannot withstand high temperature environments. Therefore, high temperature pressure sensors have become a hot research point at present. [0003] At present, the pressure sensor chip is packaged by wire bonding, but the maximum operating temperature of this packaging method is difficult to exceed 125 °C. The phenomenon of "gold brittleness" will also occur at high temperature of wire bonding, resulting in gold wire breakage and low vibration resistance. Therefore, The use temperature and environment are limited, and there are restrictions on the use temperature. Based on this, the pres...
Claims
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IPC IPC(8): B81C1/00G01L1/00
CPCB81C1/00269B81C1/00325B81C1/00301G01L1/00
Inventor 肖瑞斌罗进李鹏
Owner 成都倍芯传感技术有限公司