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Temperature and pressure integrated sensor and packaging method

A technology of temperature, pressure and sensors, which is applied in the field of sensor structures, can solve problems such as inconsistencies in the optimum working temperature of temperature-sensitive components, and achieve the effects of weakening heat transfer efficiency, reducing processing difficulty, and optimizing structure

Pending Publication Date: 2022-06-24
HUNAN QITAI INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So as to solve the technical problem that the optimal working temperature of the pressure sensitive element and the temperature sensitive element are inconsistent, and ensure that the temperature sensitive element can quickly and accurately measure the temperature of the medium, and at the same time make the pressure sensitive element work in a suitable temperature environment

Method used

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  • Temperature and pressure integrated sensor and packaging method
  • Temperature and pressure integrated sensor and packaging method
  • Temperature and pressure integrated sensor and packaging method

Examples

Experimental program
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Effect test

Embodiment 1

[0066] like figure 1 - Figure 8 As shown, an integrated temperature and pressure sensor includes a welded upper casing 4 and a lower casing 5, a support frame 3, a circuit board 2 and a plastic casing 1, the support frame 3 is arranged on the top of the upper casing 4, and the circuit board 2 is arranged on the support frame 3, the plastic casing 1 is arranged above the support frame 3 and is connected with the top of the upper casing 4, and the lower end of the lower casing 5 is sequentially formed with a threaded connector 51 and a first boss 52 from top to bottom. A boss 52 has a cylindrical structure and the diameter of the first boss 52 is smaller than the diameter of the threaded connector 51 ; the upper casing 4 and the lower casing 5 are both made of stainless steel.

[0067] like Figure 4 - Figure 7 As shown, the lower end of the first boss 52 is formed with a temperature measurement probe 7 downward, and the temperature measurement probe 7 is provided with a te...

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PUM

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Abstract

The invention belongs to the technical field of sensor structures, aims to solve the technical problem that the optimal working temperatures of a pressure-sensitive element and a temperature-sensitive element are inconsistent in the prior art, and provides a temperature and pressure integrated sensor which comprises an upper shell, a lower shell, a supporting frame, a circuit board and a plastic shell, the supporting frame is arranged in the upper shell, the circuit board is arranged on the supporting frame, the plastic shell is arranged above the supporting frame and connected with the top of the upper shell, and a threaded connector and a first boss are sequentially formed at the lower end of the lower shell from top to bottom. The first boss is of a cylindrical structure, and the diameter of the first boss is smaller than that of the threaded connector. And a temperature measuring probe is downwards formed at the lower end of the first boss. According to the integrated packaging structure of the temperature and pressure sensor, the contact surface between the temperature-sensitive element and the measured medium and the heat transfer efficiency are increased, and the contact surface between the pressure-sensitive element and the measured medium and the heat transfer efficiency are reduced.

Description

technical field [0001] The invention relates to the technical field of sensor structures, in particular to a temperature and pressure integrated sensor and a packaging method. Background technique [0002] In the fields of industry, automobile, aerospace, etc., there is a wide range of requirements for pressure and temperature measurement, and in many cases, both signals need to be sensed at the same time, such as automotive air conditioning systems, diesel high pressure common rail systems, etc. Most of the traditional measurement methods use two independent sensors for measurement, resulting in complex and unreliable systems. In recent years, some integrated temperature and pressure sensors have appeared, realizing the integration of sensors. [0003] The optimal working temperature range of the pressure-sensitive element and the temperature-sensitive element is inconsistent, but the existing temperature-pressure integrated sensor does not have effective measures for the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01D11/24G01D11/00C23C16/02C23C16/40C23C16/56
CPCG01D21/02G01D11/24G01D11/00C23C16/0227C23C16/0245C23C16/402C23C16/56
Inventor 王国秋王维忠黄坚
Owner HUNAN QITAI INFORMATION TECH
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