Grinding device and grinding method for wedge angle wafer
A grinding device and wedge angle technology, which is applied in the direction of grinding devices, grinding machine tools, grinding tools, etc., can solve problems such as not suitable for single-piece and small-batch processing, poor geometric accuracy of wafers, poor controllability and stability, etc., to achieve Solve the difficulty of processing end point detection, reduce assembly accuracy and improve processing efficiency
Pending Publication Date: 2022-07-08
DALIAN UNIV OF TECH
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[0003] At present, there are roughly two grinding methods for wedge-shaped wafers. "Second-level Germanium Scanning Optical Wedge Processing and Inspection Methods" introduces a method of wedge-angle processing wafers by bonding wedge-shaped auxiliary blocks. The precision requirements are too high. When processing wedge blocks of various specifications, it is necessary to prepare high-precision wedge blocks of different specifications, which is costly and not suitable for single-piece and small-batch processing; patent CN201811142042.3 introduces a method of processing wedges by eccentric loading Angle method, this method often mainly relies on experience, the controllability and stability in the processing process are poor, and the geometric accuracy of the wafer becomes worse after grinding, so it is difficult to obtain high geometric accuracy
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[0034] The present invention will be further described below with reference to the accompanying drawings. like Figure 1-8 As shown, a grinding device for wedge-angle wafers includes a body, a polishing head, a grinding pad 13 and a lower disc 14. The upper end of the polishing head is connected to the transmission device of the body, and the lower end of the lower disc 14 is connected to the machine. The transmission device of the body is connected, and the grinding pad 13 is pasted on the top of the lower plate 14;
[0035] The polishing head includes a rotating spindle 1, a mounting plate 2, a pressure sensor 3, a bearing 4, a dual-axis inclination sensor 5, an acoustic emission sensor 6, a connecting plate 7, a bearing sleeve 8, an end cover 9, an inclination adjustment unit 10, a load Object tray 11, transmission ring 15 and sliding pad 16;
[0036] The upper end of the rotating spindle 1 is connected to the transmission device of the fuselage, and the lower end is conn...
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The grinding device comprises a polishing head, a grinding pad and a lower disc, and the polishing head comprises a rotating main shaft, a mounting plate, a pressure sensor, a bearing, a double-shaft inclination angle sensor, an acoustic emission sensor, a connecting plate, a bearing sleeve, an end cover, an inclination angle adjusting unit, a carrying disc, a transmission ring and a sliding pad. Adjustment of the inclination angle of the objective table is achieved through the two ball hinge devices, left-right and front-back swing of the adjusting platform can be achieved by adjusting the two perpendicular micrometer rotary knobs, the adjusting platform is suitable for machining of wedge-angle wafers of various specifications, operation is easy, cost is reduced, accurate measurement of the inclination angle of the objective table can be achieved in cooperation with a double-shaft inclination angle sensor, and machining precision is guaranteed. The pressure sensor is adopted for detecting and feeding back the pressure borne by the workpiece, and the phenomenon that the workpiece is broken is prevented. The acoustic emission sensor is used for detecting the workpiece machining condition, and the problem that the machining end point of the wedge-shaped wafer is difficult to detect is solved.
Description
technical field [0001] The invention belongs to the technical field of ultra-precision machining of wedge-shaped wafers, in particular to a grinding device and a grinding method for wedge-shaped wafers Background technique [0002] The wedge-angle wafer has two non-parallel planes, which can adjust the angle of the optical path and avoid the interference effect (Etalon effect) caused by the reflected light from the front and rear surfaces. Wedge-angle wafers are usually made as windows, beamsplitters, etc., and are an indispensable part of aerospace, laser systems, optical instruments and other fields. [0003] At present, there are roughly two grinding methods for wedge-angle wafers. In "Second-level Germanium Scanning Optical Wedge Processing and Detection Method", a method for wedge-angle processing of wafers by bonding wedge-shaped auxiliary blocks is introduced. The precision requirements are too high. When processing a variety of wedge-shaped blocks, it is necessary t...
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Login to View More IPC IPC(8): B24B37/005B24B37/11B24B37/27B24B1/00
CPCB24B37/005B24B37/11B24B37/27B24B1/00
Inventor 康仁科朱祥龙董志刚贾玙璠高尚郭晓光
Owner DALIAN UNIV OF TECH