Demolding device for manufacturing semiconductor lead frame etching product
A lead frame and product manufacturing technology, applied in semiconductor/solid-state device manufacturing, cleaning methods using liquids, electrical components, etc., can solve the problems of product adhesion to foreign objects, unstable product quality, etc., to achieve the effect of improving automation
Pending Publication Date: 2022-07-08
KUNSHAN YIDING IND TECH CO LTD
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Problems solved by technology
[0005] The purpose of the present invention is to provide a stripping device for manufacturing semiconductor lead frame etching products, so as to solve the technical problem that the metal photosensitive film material after etching has foreign matter attached to the product in the stripping section, resulting in unstable product quality. Spray wetting, spray impregnation, and spray impact of membrane devices to greatly reduce the phenomenon of foreign matter attached to etching products
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[0037] like Figure 1 to Figure 3 As shown in the invention, the stripping device for manufacturing the etched product of the semiconductor lead frame includes: a water immersion washing upper tank 1, a water spray washing upper tank 2 and a film stripping mechanism 3 that are connected in sequence, so that the etched product can pass through the sequentially connected immersion washing upper tank. 1. The upper tank 2 and the stripping mechanism 3 are washed with water, so that the etching equipment can be subjected to the spray wetting, spray penetration, spray expansion and spray impact of the stripping solution, thereby removing the photosensitive dry film in the exposed area. In this embodiment, the pressure and speed of jet wetting, jet penetration, jet expansion and jet impact can be set and controlled respectively, the jet pressure range is 0.3-1.3Pa, and the jet speed range is 5.3-10.3 liters / min; its features are: Also, since the developed dry film and the undeveloped...
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The invention belongs to the technical field of semiconductor integrated circuit lead frame etching manufacturing, and particularly relates to a demolding device for manufacturing a semiconductor lead frame etching product, which comprises a soaking washing upper groove, a water spraying washing upper groove and a demolding mechanism which are communicated in sequence, the upper soaking washing tank is communicated with an upper water filtering system, the upper water filtering system adopts a water pump for conveying, and the upper soaking washing tank is communicated with a mother tank self-circulation system; the water spray washing upper tank comprises a tank body, an inner sub-tank arranged at the bottom of the tank body and an upper spray pipe arranged at the upper part of the tank body; the demolding mechanism comprises a butt-joint frame in butt joint with the water spray washing upper groove, a rotating roller arranged in the butt-joint frame and a rotating motor used for driving the rotating roller to rotate. The demolding device for manufacturing the semiconductor lead frame etching product has the effect that the phenomenon that foreign matters are attached to the etching product is greatly reduced through spraying infiltration, spraying dipping and spraying impact of the demolding device.
Description
technical field [0001] The invention belongs to the technical field of etching and manufacturing of semiconductor integrated circuit lead frames, and in particular relates to the invention of a stripping device for manufacturing etching products of semiconductor lead frames. Background technique [0002] In the field of semiconductor lead frame manufacturing technology, using etching technology to manufacture and process metal materials into precision semiconductor electronic products required in various high-tech fields has become a very important issue. For example, the important technical core of semiconductor integrated circuits, chip manufacturing technology is an important foundation and core component of the development of advanced science and technology; semiconductor lead frames, as chip carriers of integrated circuits, are important basic raw materials in the electronic information industry; therefore, semiconductor lead frames Frame manufacturing technology is an ...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/48B08B3/02B08B3/08B08B3/14B08B13/00
CPCH01L21/4821B08B3/02B08B3/08B08B3/14B08B13/00
Inventor 陈利解门松明珠周爱和
Owner KUNSHAN YIDING IND TECH CO LTD