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Sensor device and ground connection

A technology of sensor equipment and mating connection, which is applied in the direction of connection, fixed connection, and components of connecting devices, etc., can solve the problems of the manufacturability of sensor equipment, and does not allow damping of vibration, and achieves the goal of improving manufacturability and simplifying manufacturing. Effect

Pending Publication Date: 2022-07-08
梅斯法国公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resins do not allow damping of vibrations due to their rigid material properties
Furthermore, since it involves the mounting of several components (18, 20), as well as the steps of soldering and potting, the manufacturability of this sensor device suffers

Method used

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  • Sensor device and ground connection
  • Sensor device and ground connection
  • Sensor device and ground connection

Examples

Experimental program
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Effect test

Embodiment Construction

[0062] The present invention will now be described with reference to the accompanying drawings. Various structures, systems and devices are schematically depicted in the drawings for purposes of explanation only and in order not to obscure the disclosure with details that are well known to those skilled in the art. However, the accompanying drawings are included to describe and explain illustrative examples of the present disclosure. The words and phrases used herein should be understood and interpreted to have a meaning consistent with the understanding of these words and phrases by those skilled in the relevant art. A specific definition of a term or phrase, ie, a definition that differs from its ordinary or customary meaning as understood by those skilled in the art, does not imply consistent use of the term or phrase herein.

[0063] In the following, elements with the same reference numerals that have been described and shown with respect to one figure will not necessari...

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PUM

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Abstract

The invention relates to a sensor device comprising an electrical conductor (120, 520, 720) adapted to house at least a first printed circuit board (PCB) and a second PCB, said sensor device being characterized in that the first PCB (102, 502, 702) and the second PCB (104, 504, 704) are connected together by flexible conductive means (106, 506, 706), and said sensor device further comprising at least one conductive spring (200, 400, 600, 600a, 800, 800a), the at least one conductive spring is held between the two PCBs by a snap-fit, form-fit or press-fit connection such that a first portion (202, 602, 802) of the spring is pressed against one of the PCBs (102, 502, 702) and a second portion (204, 604, 804) of the spring is pressed against the electrical conductor (120, 520, 720) to maintain an electrical connection between the electrical conductor and the PCBs.

Description

technical field [0001] The invention relates to the technical field of industrial sensors, in particular to the electrical grounding of sensor equipment Background technique [0002] Sensor devices, such as fluid sensor devices, may include sensors, such as temperature sensors, and / or mechanical resonators, such as tuning fork resonators. A sensor device usually needs to interconnect at least two printed circuit boards (PCBs) and ground the PCBs for electrostatic discharge (ESD: electrostatic discharge) protection and to prevent electromagnetic interference (EMI noise). [0003] Spring contacts, also known as spring fingers or ground contacts, are commonly used for grounding between the device and the PCB. The spring contacts are soldered on the PCB. However, in many applications, like implementing a sensor device in a vehicle, vibration can create stress and fatigue on the solder joint between the spring contacts and the PCB, weakening the connection. [0004] In some se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/00H01R12/51
CPCH05K9/0064H05K9/0067H05K7/00H01R12/51H05K9/0039G01D11/245H01R13/648H01R13/2407H01R13/627H01R13/533H01R13/639H01R12/523H01R12/585
Inventor V.莱格Y.维达尔J.杜克洛斯
Owner 梅斯法国公司