Heat dissipation device for board card chip and use method of heat dissipation device

Abstract

The invention discloses a heat dissipation device for a board card chip and a use method of the heat dissipation device. The heat dissipation device is connected between the chip and a heat dissipation device. The device comprises an elastic radiating pipe, the elastic radiating pipe comprises a U-shaped radiating pipe, and the two ends of an opening of the U-shaped radiating pipe are connected with a chip and a radiator respectively; the U-shaped heat dissipation pipe comprises an arc-shaped pipe, a first extending part and a second extending part, the first extending part and the second extending part are connected to the two ends of an opening of the arc-shaped pipe respectively, the first extending part and the second extending part extend along the end of the opening of the arc-shaped pipe respectively, and the first extending part and the second extending part extend towards the two sides of the plane where the arc-shaped pipe is located respectively. The manufacturing error and the assembling error of the case can be eliminated through the deformation amount of the elastic heat dissipation pipe, the efficient heat conduction effect is achieved, meanwhile, the pressing force is provided, the gap filling effect is eliminated, and therefore the heat dissipation effect is further improved.

Description

technical field [0001] The invention relates to the field of server heat dissipation, in particular to a heat dissipation device for a board card chip and a method for using the same. Background technique [0002] At present, the power consumption of electronic devices such as servers, switches, and communication base stations continues to increase, and the problem of heat dissipation has gradually become a bottleneck restricting the performance improvement of the above-mentioned devices. [0003] In order to improve the heat dissipation performance of electronic equipment, in addition to the technical means of optimizing the heat dissipation layout and using heat transfer materials with high thermal conductivity, minimizing the contact gap between the heat sink and the heating components is also effective to improve the heat dissipation efficiency of electronic equipment. Technical approach, this is because the contact surface between the radiator and the heating element is...

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Problems solved by technology

[0003] In order to improve the heat dissipation performance of electronic equipment, in addition to optimizing the heat dissipation layout and using high thermal conductivity heat transfer materials, reducing the contact gap between the heat sink and heating components is also an effective way to improve the heat dissipation efficiency of electronic equipment. Technical approach, this is because the contact surface between the radiator and the heating element is often rigid, and the surface of the two rigid contact surfaces is not absolutely flat microscopically, so by filling the contact surface between the radiator and the heating element Thermal interface materials can fill the air gap between rigid contact surfaces to improve heat transfer efficiency, but because the thermal conductivity of thermal interface materials is still lower than that of metals, the contact surface gap between the radiator and the heating element is still a constraint An important factor affecting heat dissipation performance, but due to the existence of machining errors and assembly tolerances of parts, the gap between the contact surfaces will not be infinitely small, and a tolerance margin must be left to avoid interference between the heat sink and the rigid contact surface of the chip

[0004] Although the existing design has technical means such as spring screws to eliminate the gap, it can only be applied to the heat sink of a single component and needs to leave mounting holes on the PCB card. Therefore, a heat dissipation device is still needed that can adaptively eliminate the heat sink. The contact gap with the heating element can fill the contact gap between the radiator and the heating element according to the design requirements, and provide the required pressing force, effectively reduce the thermal resistance and optimize the heat dissipation

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