Method for dissolving silicon dioxide

Abstract

The invention discloses a method for rapidly dissolving silicon dioxide. The method comprises the following steps: feeding a silicon dioxide-containing solution into a solution tank containing an alkaline solution to primarily dissolve the silicon dioxide; sending the primarily dissolved silicon-containing solution into a heating tank; sending an acidic material into a heating tank; the method comprises the following steps: mixing an acidic substance and a silicon-containing solution which is initially dissolved in a heating tank, heating at the temperature of 80-160 DEG C, and feeding an acid solution containing silicon dioxide into a process cavity. According to the method, the silicon dioxide is initially dissolved, and then the initially dissolved silicon dioxide is fed into the acidic material for reaction, so that the dissolution of the silicon dioxide is accelerated, the reaction time is prolonged, the characteristics of the liquid medicine can be adjusted by adjusting the content of silicon, the liquid medicine blending time is greatly shortened, and the subsequent use requirements are met.

Description

technical field [0001] The invention belongs to the technical field of silica dissolving methods, and particularly relates to a method for dissolving silica. Background technique [0002] Silica is an inorganic substance with the chemical formula SiO2. Silicon atoms and oxygen atoms are arranged in long-range order to form crystalline silica, and short-range order or long-range disorder form amorphous silica, which is widely found in rocks, Among the gravel and dust. [0003] In order to accelerate the etching rate of acid solution to some special substances, silica solution is usually added to the acid solution to achieve the purpose, and the current conventional method is the direct addition method, which puts silica into the acid solution, but Due to the characteristics of silicon dioxide, the dissolution of silicon dioxide often takes a long time, resulting in a long etching time, which cannot meet the needs of actual production. SUMMARY OF THE INVENTION [0004] The...

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Problems solved by technology

[0003] In order to accelerate the etching rate of some special substances by acidic solution, silicon dioxide solution is usually added to the acidic solution to achieve the purpose, and the current conventional method is to directly add silicon dioxide into the acidic solution, but Due to the characteristics of silicon dioxide, the dissolution of silicon dioxide often takes a long time, resulting in a longer etching time, which cannot meet the actual production needs

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