Motor cooling structure of vacuum manipulator and cooling method thereof

Abstract

The invention relates to a motor cooling structure of a vacuum manipulator and a cooling method thereof. The motor cooling structure comprises a motor, a semiconductor chilling plate and a metal structural member, the motor is arranged in the vacuum cavity; the cold end of the semiconductor chilling plate is attached to the motor, and the hot end is attached to the metal structural part. The metal structural part is arranged on the vacuum cavity, part of the metal structural part is located in the vacuum cavity, and the rest of the metal structural part extends out of the vacuum cavity. The motor can be cooled through the semiconductor chilling plate, heat generated by the semiconductor chilling plate is transmitted to the atmospheric environment through the metal structural part, and therefore the cooling purpose is achieved, the power transmission structure of the vacuum mechanical arm is greatly simplified, the vacuum cavity is shrunk, and the mechanical arm is more compact. And the mechanical track of the arm can be optimized by adding a small motor at a key position, so that the stroke is further shortened, and the speed of completing one-time wafer transfer by the vacuum manipulator is improved.

Description

technical field [0001] The invention relates to the technical field of vacuum heat dissipation, in particular to a motor cooling structure of a vacuum manipulator and a cooling method thereof. Background technique [0002] The vacuum robot used in semiconductor processing engineering is the key automation equipment responsible for the transfer of wafers between different stations in a vacuum environment. The transfer speed of the transmission system where the vacuum manipulator is located largely dominates the production speed of the entire semiconductor machine, which greatly affects its production efficiency. [0003] In a vacuum environment, the only way of heat transfer is thermal radiation. The efficiency of heat transfer by thermal radiation is not enough to transfer the heat generated by the motor in a vacuum environment to the outside, causing the temperature of the motor body to rise. Above the temperature threshold for normal operation of the motor, the motor wil...

AI Technical Summary

Problems solved by technology

The complex structure makes its response time longer, and the larger mechanical size requires the design of a larger vacuum chamber to accommodate the vacuum robot arm, which forces the size of the entire machine to become larger, thereby increasing the difficulty and cost of cavity structure processing; On the other hand, the manipulator will need to complete a longer travel distance due to the larger chamber environment to complete a wafer handling operation, further prolonging the transfer time

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