Semiconductor circuit, packaging structure using same and preparation method of packaging structure

Abstract

The invention discloses a semiconductor circuit, a packaging structure using the same and a preparation method of the packaging structure. The semiconductor circuit comprises a driving HVIC chip, a high-side driving module and a low-side driving module, the driving HVIC chip is electrically connected with the high-side driving module, the high-side driving module comprises three upper bridge power elements, and each upper bridge power element is of an RC-IGBT structure; the driving HVIC chip is electrically connected with the low-side driving module, the low-side driving module comprises three lower bridge power elements, and each lower bridge power element comprises an IGBT (Insulated Gate Bipolar Translator) tube and a fly-wheel diode; the input end of the upper bridge power element is electrically connected with the driving HVIC chip; according to the semiconductor circuit, the packaging structure using the semiconductor circuit and the preparation method of the packaging structure, an upper bridge uses an RC-IGBT structure, a lower bridge uses a structure of an IGBT tube and a fly-wheel diode, the module cost is reduced, and the reliability of the module is improved. And meanwhile, the module has the advantages of high input impedance, low control power, simple driving circuit, high switching speed, low conduction voltage drop, large on-state current, low loss, better reverse recovery capability and the like.

Description

technical field [0001] The invention relates to the field of semiconductor power devices, in particular to a semiconductor circuit, a package structure using the same, and a preparation method of the package structure. Background technique [0002] Intelligent Power Module, IPM (Intelligent Power Module), is a power drive product that combines power electronics and integrated circuit technology. The intelligent power module integrates the power switching device and the high-voltage drive circuit, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the intelligent power module receives the control signal of the MCU to drive the subsequent circuits to work, and on the other hand, sends the system status detection signal back to the MCU. Compared with traditional discrete solutions, intelligent power modules have won more and more markets due to their high integration and high reliability. It is an ideal power electroni...

AI Technical Summary

Problems solved by technology

At present, the upper and lower bridge power devices of the IPM intelligent power module generally adopt a separate IGBT+FRD structure or a separate RC-IGBT structure, using a single structure, and the function of the module is relatively single

Images