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Selective laser melting forming method for rapidly preparing high-flux composite material

A technology of selective laser melting and composite materials, applied in the field of materials, it can solve the problems of powder performance not meeting requirements, powder cannot be reused, and power consumption is large, and achieves the effect of flexible molding components, saving raw material costs, and ensuring consistency.

Pending Publication Date: 2022-07-29
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Carrying out ten experiments independently not only consumes argon gas, but also consumes a lot of electricity, and before conducting independent experiments, powder needs to be prepared, and the powder mixing scale is several kilograms each time.
Once it is known through SLM molding that the performance of this component powder does not meet the requirements, then the several kilograms of powder mixed this time cannot be reused and are almost wasted.

Method used

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  • Selective laser melting forming method for rapidly preparing high-flux composite material
  • Selective laser melting forming method for rapidly preparing high-flux composite material
  • Selective laser melting forming method for rapidly preparing high-flux composite material

Examples

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Embodiment 1

[0050] For the selective laser melting molding method for rapidly preparing high-throughput composite materials in this embodiment, the alloy composition is first designed: GH4169, TC4, and SUS316 alloy powders are mixed with ZrO2 ceramic powder respectively, and the mass percentage of metal and ceramic powder is set to 1 in turn. :99, 3:97, 5:95, 7:93, 9:91. Mix the above weighed powder evenly, such as putting it into a vial, and then shake it uniformly at 720° by hand to mix the powder uniformly.

[0051] Design array hole and slot structure: its structure is as follows image 3 shown. The array hole and slot structure includes a bottom mold (the bottom of the array body) and a frame mold (the enclosing part around the bottom mold) to form an array body with a working cavity mold (a cavity that carries metal powder). The upper part of the hole shape is a square structure. The array hole-groove structure is generally made of metal materials, such as copper alloy, aluminum ...

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Abstract

The invention relates to the technical field of materials, in particular to a selective laser melting forming method for rapidly preparing a high-flux composite material, an array hole groove structure is installed on a forming platform, and the array hole groove structure comprises an array body which is composed of a bottom die and a frame die and provided with a working cavity die; the array hole groove structure is embedded in a forming platform substrate of a forming area, then prepared metal powder is added into the array hole groove structure, and the powder surface is adjusted to a laser focusing plane; by setting the array entity, the three-dimensional shape of the array entity is converted into a two-dimensional plane structure so as to be mapped to the powder in the array hole groove structure. Compared with existing high-flux SLM forming equipment, the selective laser melting forming method has the advantages that components are more flexible, and the types of components formed at a time are numerous. And the preparation of the SLM high-throughput sample can be realized without any modification on the whole equipment, so that experimental support is provided for SLM high-throughput component design and forming.

Description

technical field [0001] The invention relates to the technical field of materials, and more particularly, to a selective laser melting molding method for rapidly preparing high-throughput composite materials. Background technique [0002] Selective Laser melting (SLM) technology is actually a laser additive manufacturing technology developed on the basis of Selective Laser Sintering (SLS) technology. It emits a laser beam through the laser transmitter, then passes through the scanning mirror, and then focuses the laser spot on the powder of the forming platform through the focusing optical device, and melts the metal powder / ceramic powder through the heat generated by the laser focusing for forming. [0003] When the first layer is formed, the forming platform drops by one slice thickness, the powder bin rises to a certain thickness, and then the powder is evenly spread on the forming platform by the scraper, and the laser melting and forming are continued. Molding is comple...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F10/28B22F12/30B22F10/366B22F10/364B22F10/38B33Y10/00B33Y30/00
CPCB22F10/28B22F12/30B22F10/366B22F10/364B22F10/38B33Y10/00B33Y30/00
Inventor 计效园涂先猛周建新陈嘉龙殷亚军李天佑伍缘杰沈旭
Owner HUAZHONG UNIV OF SCI & TECH
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