Novel-structure power module directly taking radiator as shell and preparation method of novel-structure power module

Abstract

The invention relates to the technical field of electronics, in particular to a novel-structure power module directly taking a radiator as a shell and a preparation method, and the novel-structure power module comprises a radiator body which is provided with a groove; the copper-clad ceramic substrate is flatly laid and fixed at the bottom of the groove, the copper-clad ceramic substrate is connected with the radiator through heat conduction brazing filler metal, and a chip and a signal transmission terminal are arranged on the copper-clad ceramic substrate; a groove is formed in the radiator body, a silica gel protective layer formed by silica gel is filled in the groove, the signal transmission terminal extends out of the silica gel protective layer to be connected with an external application end, the radiator body is a radiator made of metal materials, and radiating fins are further arranged on the radiator body. The heat dissipation efficiency between the power module and the radiator body is high; when the power module fails and explodes, the injection direction of a failure object can be controlled, and other components in the whole machine are prevented from being damaged.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a power module directly using a radiator as a casing and a preparation method of the power module. Background technique [0002] The structure of the conventional power module is that the chip and the copper-clad ceramic substrate are welded together, and then welded together with the copper base plate. . During the use of the power module, first brush thermal grease on the back of the copper base plate, and then apply pressure by screwing the screws to install the power module on the radiator body. At this time, the thermal grease fills the space between the copper base plate and the radiator body. gap. Because the conventional power module is a plastic shell, the heat dissipation performance is poor, and the heat dissipation of the power device in the prior art is carried out by thermally conductive silicone grease, and the heat dissipation coefficient of the thermally co...

AI Technical Summary

Problems solved by technology

Because the conventional power module is a plastic shell; the heat dissipation performance is poor, and the heat dissipation of the power device in the prior art is carried out through thermal conductive silicone grease, and the heat dissipation coefficient of thermal conductive silicone grease is relatively low, which affects the heat dissipation of the power module; moreover, engineering plastics The hardness of the power module is low, and it cannot form a sufficient protective effect. When the power module fails and explodes, it will spray the failure in all directions, resulting in damage to the surrounding components.

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