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Photoelectric packaging shell and manufacturing process thereof

A technology of manufacturing process and packaging shell, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve problems such as surface cracks and air bubbles, achieve high yield, simple manufacturing process steps, and improve quality

Pending Publication Date: 2022-07-29
NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, it is necessary for the present invention to provide a manufacturing process for an optoelectronic packaging shell. By optimizing the deglue and vitrification process in the manufacturing process of the glass insulator, the quality of the glass insulator is improved, and the problem of high temperature sealing of the glass insulator is solved. Eliminate the problems of internal air bubbles and surface cracks, improving the appearance, quality and reliability of sealed products

Method used

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  • Photoelectric packaging shell and manufacturing process thereof
  • Photoelectric packaging shell and manufacturing process thereof
  • Photoelectric packaging shell and manufacturing process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0048] The pressed glass powder is heated from room temperature to 530°C at a rate of 5°C / min for debonding, then kept at 700°C for 60 minutes, and then cooled to room temperature at a rate of 50°C / min to complete vitrification to obtain a glass insulator;

[0049] The glass insulator, the pre-treated chassis and the leads are fixed by a graphite sealing mold, and then high-temperature sealing is performed.

[0050] The surface of the semi-finished shell is plated with a nickel layer with a thickness of 5.4 μm and a gold layer with a thickness of 2.3 μm to prepare an optoelectronic packaging shell.

Embodiment 2

[0052] This embodiment adopts the same steps as in Embodiment 1, and the specific parameters are shown in Table 1. Other parameters, processes, etc. that are not listed are the same as those in Embodiment 1.

Embodiment 3

[0054] This embodiment adopts the same steps as in Embodiment 1, and the specific parameters are shown in Table 1. Other parameters, processes, etc. that are not listed are the same as those in Embodiment 1.

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Abstract

The invention discloses a photoelectric packaging shell and a manufacturing process of the packaging shell, and the manufacturing process of the packaging shell mainly comprises the following steps: obtaining a glass insulator, the glass insulator is obtained by pressing, glue discharging and vitrification of glass powder, and the glue discharging and vitrification process comprises the following steps: heating the pressed glass powder from room temperature to 400-530 DEG C at a heating rate of less than or equal to 20 DEG C / min; then heat preservation is conducted for 60-120 min at the temperature of 650-700 DEG C Finally, cooling to room temperature at the speed of 50-100 DEG C / min; performing high-temperature sealing on the glass insulator and the pretreated chassis and lead to obtain a shell semi-finished product; and plating a metal layer on the surface of the shell semi-finished product to prepare the photoelectric packaging shell. By adopting the manufacturing process to manufacture the photoelectric packaging shell, the appearance, the quality and the reliability of a sealing product are improved, and the rate of finished products is more than 99%.

Description

technical field [0001] The invention belongs to the field of optoelectronic device encapsulation, and in particular relates to a manufacturing process of an optoelectronic encapsulation shell, and an optoelectronic encapsulation shell prepared by the manufacturing process. Background technique [0002] Optoelectronic devices refer to various functional devices made by utilizing the electro-photon conversion effect, which are the key and core components of optoelectronic technology. Generally speaking, optoelectronic devices can be divided into active devices and passive devices, which are widely used in optoelectronic integrated circuits. [0003] As an important part of providing mechanical support and airtight protection for optoelectronic chips and optical components, the encapsulation shell can provide electrical signal transmission channels and optical coupling interfaces for optoelectronic devices, and solve the interconnection between chips and external circuits and o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0203H01L31/18
CPCH01L31/0203H01L31/18Y02P70/50
Inventor 宁峰鸣张凤伟史常东计雨辰
Owner NO 43 INST OF CHINA ELECTRONICS TECH GRP CETC
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