Preparation method of electromagnetic shielding composite film layer based on non-metallic material

Abstract

The invention discloses a preparation method of an electromagnetic shielding composite film layer based on a non-metallic material. An organic coating is sprayed on the surface of a base material as a connecting layer with the thickness of 20-60 [mu]m, a conductive coating is sprayed on the surface of the connecting layer as a conductive layer with the thickness of 20-40 [mu]m, a nickel layer is electroplated on the surface of the conductive layer as a reinforcing layer with the thickness of 20 [mu]m, and the high-efficiency electromagnetic shielding composite film layer capable of meeting the requirement that SE is larger than or equal to 60 dB of a non-metal material part within the wide frequency band of 2 MHz to 18 GHz is designed. The film layer has good environmental adaptability, the use requirements of electronic equipment on the environment conditions such as damp and heat resistance, low temperature and high temperature under the use requirement of a wider region can be met, the preparation process steps are simple and easy to implement, no complex equipment is needed, the composite film layer can be manufactured by using common surface treatment equipment, the cost is low, the manufacturing process is simple and convenient, the feasibility is high, the control is easy, the consistency is good, and the reliability is high.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic shielding, and in particular relates to a coating technology. Background technique [0002] At present, the shell materials of various modules, plug-ins, and chassis used in electronic equipment are increasingly changing from traditional metal materials to non-metallic materials that are lighter in weight and lower in mass production costs, such as engineering plastics , carbon fiber composites, glass fiber composites, organic fiber composites, etc. [0003] In order to ensure the normal operation of circuits and components, modules, plug-ins, and chassis shells must have electromagnetic shielding performance to solve the problem of coupling interference. The casing made of non-metallic materials cannot meet the electromagnetic shielding effect because it does not have electrical conductivity and magnetic permeability. It is necessary to metallize the surface of the non-metallic material ...

AI Technical Summary

Problems solved by technology

The former is low in cost, simple in process, and widely used, but its conductivity is low. Most conductive coatings lack magnetic permeability, and the electromagnetic shielding performance is not ideal especially in low frequency areas.

The metal coating obtained by the latter has a higher conductivity, and a metal layer with better magnetic permeability can be obtained by nickel plating, but the process control is complicated, the environmental stress resistance is poor, and the adaptability to the workpiece is narrow.

[0005] The inert surface properties of most non-metallic composite materials prevent high adhesion of conductive paints and platings

Therefore, the two most commonly used metallization methods for electromagnetic shielding cannot effectively meet the long-term electromagnetic shielding requirements of the functionalization of non-metallic structures of electronic equipment used in complex environments.

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