Semiconductor packaging structure and packaging method
A packaging structure and packaging method technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effect of avoiding ventilation channels, strong weather resistance, and improving sealing
Active Publication Date: 2022-07-29
广东中科半导体微纳制造技术研究院 +1
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Problems solved by technology
[0003] The main purpose of the present invention is to provide a semiconductor packaging structure and packaging method, aiming to solve the technical problem of how to improve the sealing of semiconductor elements
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[0077] In the first embodiment, the side wall includes an interconnected base body and a connecting ring surrounding the metal connector. The high-energy beam emitted by the transmitter is controlled to move according to a preset trajectory, and the high-energy beam acts on the metal connector. Steps Including: controlling the high-energy beam emitted by the transmitter to move along the trajectory between the metal connecting piece and the connecting ring. Under the action of the high-energy beam, part of the metal connector and part of the connecting ring begin to melt at the same time, forming a molten pool, the molten metal connector and the molten connecting ring form an alloy, and the alloy solidifies to form a connecting part, thereby affecting the accommodating space. For sealing, it should be noted that the base body and the connecting ring can be made of different materials, wherein the material of the connecting ring can be iron, cobalt, nickel, silver, stainless ste...
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Abstract
The invention discloses a semiconductor packaging structure and a packaging method, and relates to the technical field of semiconductor packaging, the semiconductor packaging structure comprises a substrate, a support, a semiconductor element, a light-transmitting component and a connecting part, the substrate comprises a bottom plate and a side wall surrounding the bottom plate, the side wall and the bottom plate define an accommodating space, and the side wall is arranged on the bottom plate; conductive layers are arranged on the top surface and the bottom surface of the bottom plate; the support is located in the containing space and installed on the conductive layer on the top face of the bottom plate, and the support is a piece made of conductive materials. The semiconductor element is mounted on the bracket; the light-transmitting component covers the substrate, the light-transmitting component comprises a light-transmitting piece and a metal connecting piece surrounding the light-transmitting piece, and the bottom surface of the metal connecting piece abuts against the top surface of the side wall; the connecting part is connected with the side wall and the metal connecting piece, and the connecting part is located on the radial extension line of the light-transmitting piece and used for sealing the containing space. High-energy beam welding is adopted, the substrate does not need to be placed in a high-temperature environment, generation of a ventilation channel is avoided, and the sealing performance of the containing space is ensured.
Description
technical field [0001] The present invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure and packaging method. Background technique [0002] At present, optoelectronic devices are widely used. In different application scenarios, optoelectronic devices need to face harsh environments such as high salt or high humidity. In these environments, existing optoelectronic devices have poor sealing performance in these harsh environments. Existing light-transmitting materials are usually bonded to the main body through glue. Although glue is used for bonding, it is relatively firm, but it is easily affected by the light environment, causing the glue to deteriorate and affect the sealing performance of optoelectronic devices. Welding method, the welding surface is usually located on the lower surface of the light-transmitting material. This welding method usually requires placing the semiconductor element in a high te...
Claims
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IPC IPC(8): H01L31/0232H01L31/0203H01L31/18
CPCH01L31/02327H01L31/0203H01L31/18
Inventor 汤乐明李文博孙钱杨勇张智聪李光辉
Owner 广东中科半导体微纳制造技术研究院