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Method for solving skip plating of fixed position of PCB (Printed Circuit Board) caused by battery effect

A technology of PCB board and fixed position is applied in the field of solving PCB board jumping plating caused by battery effect, which can solve problems such as PAD jumping plating, and achieve the effect of increasing the heating speed.

Pending Publication Date: 2022-07-29
江西景旺精密电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] Aiming at the above-mentioned existing technical defects, the present invention provides a method for solving skip plating at fixed position of PCB board caused by battery effect, effectively solving the skip plating problem existing in PAD in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] A method for a circuit board shown in this embodiment, which can solve the problem of jump plating at a fixed position of a PCB board caused by a battery effect, includes the following processing steps in sequence:

[0051] (1) Cutting: cut out the core board according to the size of the puzzle board 520mm×620mm, the thickness of the core board is 0.5mm, and the thickness of the copper layer on both surfaces of the core board is 0.5oz.

[0052] (2) Production of inner layer circuit (negative film process): The inner layer pattern is transferred, and the photosensitive film is coated with a vertical coater, and the film thickness of the photosensitive film is controlled to 8 μm. Grid exposure ruler) to complete the exposure of the inner layer circuit, and the inner layer circuit pattern is formed after development; inner layer etching, the inner layer circuit is etched from the exposed and developed core board, and the inner layer line width is measured as 3mil; the inner...

Embodiment 2

[0074] The method for a circuit board shown in this embodiment is basically the same as the method described in Embodiment 1, except that between steps (7) and (8), plug holes are also included in the metallized holes, The steps to form a fully plugged hole or a half plugged hole are as follows:

[0075] (71) Plug hole: perform resin ink plug hole treatment on at least one metallized hole of the production plate to form a plug hole;

[0076] (72) Baking: the resin ink is cured by baking, wherein the baking includes a low temperature section with a temperature ≤ 100 °C and a high temperature section with a temperature greater than 100 °C, and the heating rate in the low temperature section is controlled at 0.4-0.5 °C / min , and the heating rate in the high temperature section is controlled at 0.8-1.0 °C / min; in this step, the method of sub-baking is adopted, and the conditions of sub-baking are as follows: the first stage: temperature 50 ° C, time 30 min; Second stage: temperat...

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Abstract

The invention discloses a method for solving skip plating of a fixed position of a PCB (Printed Circuit Board) caused by a battery effect, which comprises the following steps of: providing a production board, arranging a solder resist windowing position to be subjected to nickel-gold immersion treatment and antioxidant treatment on the production board so as to expose a PAD, and arranging a non-plated-through hole and a plated-through hole on the production board; the PAD comprises a first PAD connected with the non-plated-through hole, a second PAD connected with the plated-through hole and / or a third PAD not connected with the hole; wherein the first PAD is subjected to nickel-gold deposition treatment, the second PAD connected with the plated-through hole and the plated-through hole are subjected to nickel-gold deposition treatment or anti-oxidation treatment at the same time, and the third PAD with the distance smaller than 20 mil s from the plated-through hole and the plated-through hole are subjected to nickel-gold deposition treatment at the same time; after a film is pasted on the production board, windowing is conducted on the positions corresponding to the non-plated-through holes and the positions to be subjected to nickel and gold immersion treatment; carrying out chemical nickel and gold immersion treatment on the production board; and after the film is removed, the production board is subjected to anti-oxidation treatment. The method effectively solves the problem of skip plating of the PAD in the prior art.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for solving the problem of jump plating at a fixed position of a PCB board caused by a battery effect. Background technique [0002] In the printed circuit board industry; it will be applied to many surface treatment processes; such as organic protective film OSP, immersion gold ENIG, immersion silver, immersion tin, etc. However, ENIG immersion gold surface treatment is prone to the problem of not applying nickel and gold, that is, skip plating; it is affected by various factors such as PCB board incoming materials, pretreatment capacity, load, surface tension, and wettability; especially for selected surface treatment The phenomenon that (ENIG+OSP) is not on nickel and gold is more common; [0003] In a specific production, when a selective surface treatment (ENIG+OSP) occurs, the fixed point jump cannot be plated with nickel gold; how to ...

Claims

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Application Information

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IPC IPC(8): H05K3/18C25D5/10C25D5/16
CPCH05K3/188C25D5/10C25D5/16
Inventor 王均臣张伦亮王春雪董波王亮
Owner 江西景旺精密电路有限公司
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