Production method for curing mica tape based on EB irradiation
A production method, the technology of mica tape, applied in the direction of mica, quartz/glass/glass enamel, inorganic insulators, etc., can solve the problems of low proportion, fire, insufficient interface bonding strength, etc., to reduce production costs and improve production Efficiency, the effect of reducing the amount of glue absorbed
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[0025] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0026] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must hav...
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