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Automatic dispensing equipment for diode packaging

An automatic dispensing and diode technology, applied in transportation and packaging, devices for coating liquid on the surface, coating, etc., can solve problems such as inability to dispense glue efficiently and reduce work efficiency

Active Publication Date: 2022-08-05
先之科半导体科技(东莞)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing automatic dispensing equipment for diode packaging, such as a dispensing mechanism for diode packaging disclosed in Patent No. CN202122784076.6, uses a positioning device to enhance the positioning effect of the diode, and then through the fixing column, connecting block, The setting of the dispensing cylinder, cylinder and electric push rod facilitates the extrusion of the glue in the storage cylinder, thereby filling the dispensing cylinder and dispensing through the electric push rod, but it cannot dispens efficiently and requires a manual Pulling out the material table to place the diode and positioning it greatly reduces its work efficiency

Method used

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  • Automatic dispensing equipment for diode packaging
  • Automatic dispensing equipment for diode packaging
  • Automatic dispensing equipment for diode packaging

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Embodiment Construction

[0046] In order to further understand the features, technical means, and specific goals and functions of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

[0047] like Figure 1 to Figure 11 As shown, this application provides:

[0048] An automatic glue dispensing device for diode packaging, including a frame, a glue dispensing cylinder 1, a first linear drive 2 and a glue storage cylinder; a transmission positioning assembly is also provided on the frame, and the transmission positioning assembly includes a chain plate conveyor 3 , the worktable 4, the second linear drive 5, the transmission plate 6 and the abutment plate 7, the chain conveyor 3 is arranged on the frame; the worktable 4 is arranged on the frame across the chain conveyor 3; the second linear The driver 5 is arranged on the worktable 4 and is located above the chain plate conveyor 3; the transmission pl...

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Abstract

The invention relates to the technical field of semiconductor packaging, in particular to automatic dispensing equipment for diode packaging, which comprises a rack, a dispensing cylinder, a first linear driver and a glue storage cylinder, the rack is further provided with a conveying and positioning assembly. The conveying and positioning assembly comprises a chain plate type conveyor, a workbench, a second linear driver, a transmission plate and an abutting plate. A diode is conveyed through the chain plate type conveying machine, the second linear driver stretching across the workbench of the second linear driver drives transmission plates on the two sides to face the center of the chain plate type conveying machine at the same time, and therefore abutting plates on the two transmission plates clamp the diode; and through the cambered sliding end on the upper vertical plate, the diode slides and moves to the horizontal abutting end along the sliding end to be positioned, so that a first linear driver on the rack can conveniently drive the dispensing barrel to carry out the dispensing process.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to an automatic glue dispensing device for diode packaging. Background technique [0002] Diode packaging refers to connecting circuit pins on a silicon chip to external connectors with wires for connection to other devices. In electronics, it not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrical and thermal performance, but also connected to the pins of the package shell with wires through the contacts on the chip, and these pins pass through the printed circuit. The wires on the board are connected with other devices, so as to realize the connection between the internal chip and the external circuit. Because the chip must be isolated from the outside world, in order to prevent the corrosion of the chip circuit caused by the impurities in the air, the electrical performance is degraded. On the other hand, the packag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C13/02B05C11/10B05C11/00H01L21/67H01L21/677
CPCB05C5/0208B05C13/02B05C11/1002B05C11/00H01L21/67121H01L21/6715H01L21/67742H01L21/6776
Inventor 许卫林
Owner 先之科半导体科技(东莞)有限公司
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