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Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated

A technology of metal plating and contact parts, applied in the direction of contact devices, sealing devices, printed circuit secondary treatment, etc., can solve the problems of inevitable electroplating and transmission component corrosion, impossible board, wrinkling, etc.

Inactive Publication Date: 2004-07-21
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Secondly, there is the risk that the conductive film is deformed and / or crumpled by the seal which is strongly applied to it
In addition, it is not possible to completely seal the board in the case of thick boards, because the electrolyte can reach the contact clamps and other components of the device in the space between two printed circuit boards connected one behind the other.
Uncontrolled plating of cathodically polarized parts through the electrolyte and corrosion of the transmission elements are therefore unavoidable

Method used

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  • Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated
  • Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated
  • Device and method for evening out thickness of metal layers on electrical contact points on items that are to be treated

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Embodiment Construction

[0040] exist Figure 5 A set of common electroplating equipment is represented in . Inside the working container 1 there is an upper basket anode 2 and a lower basket anode 3 . A continuous electroplating plant that is practically six meters long consists, for example, of 25 upper basket anodes and 25 lower basket anodes. They are arranged one after the other along the conveying direction of the items to be processed, for example printed circuit boards. Therefore, in the view of FIG. 1 , only one upper basket anode and one lower basket anode can be seen in the conveying direction. Also in the figure the clips 4 are also arranged one after the other. The distance from one clip to the other is, for example, 60 mm. The gripper 4 is fixed on a motor-driven endlessly circulating conveyor belt 5 . The clip 4 holds the item 7 to be treated at the clip contact point 6 (Z partial view). The gripper drives and conveys the item to be processed through the electroplating equipment. ...

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Abstract

The invention relates to a device and a method for evening out the thickness of metal layers on electrical contact points on flat items to be treated 7, such as conductor foil and printed circuit boards, during the electrolytic treatment of the items to be treated, guided in a horizontal plane of conveyance in a continuous electroplating plant. The device has counter-electrodes 2, 3 located opposite the plane of conveyance and clamps 4, secured to a continuously revolving means of conveyance 5, for contacting the items to be treated 7. The clamps 4 have a lower portion 14 and an upper portion 13 which are electrically conductive, have a surface consisting of metal, are moveable in relation to one another and respectively have at least one contact point 6 for the items to be treated 7. In addition, at least one current source is provided to produce a flow of current between the counter-electrodes and the items to be treated.To avoid the pirate cathode effect of the contact clamps 4 during electrolytic metallisation, there are disposed between the anodes 2, 3 and the clamps 4 upper and lower shields 15, 16 for the electrical field, which extend so close to the plane of conveyance that the items to be treated, guided in the plane of conveyance, and the clamp portions 13, 14 do not quite come into contact with the shields.

Description

technical field [0001] The invention relates to an electrolytic treatment of flat treatment items, such as conductive films and printed circuit boards (Leiterplatten), which are moved in the horizontal transport plane of a continuous electroplating plant, in particular during electrolytic plating, where the electrical contact points are metal Apparatus and method for uniform coating thickness. Such a device finds application in particular in installations in which handling items are conveyed in a horizontal position. Background technique [0002] In electroplating plants for metal deposition, flat substrates are usually held on one or both sides at the edges by clamps or clamps. Clamps or grippers are used to transport the process through the device and are also used for electrical contact, ie to feed the process with plating current. The processed objects concern, for example, printed circuit boards, in particular so-called multilayer circuit boards, with a board thicknes...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D5/00C25D17/06H05K3/18H05K3/24
CPCC25D17/001H05K3/241C25D7/123C25D17/06C25D17/004C25D17/005C25D17/00
Inventor 洛伦茨·科普彼得·朗海因里希莱因哈德·施奈德
Owner ATOTECH DEUT GMBH
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