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Radiator and semiconductor laser device using and same semiconductor laser stack thereof

A laser device and semiconductor technology, which is applied in the direction of semiconductor lasers, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of increasing the thickness of the radiator and manufacturing difficulties

Inactive Publication Date: 2004-09-15
HAMAMATSU PHOTONICS KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, the radiator of the above-mentioned prior art has a tubular water supply channel, which increases the thickness of the radiator and increases the size of the radiator.
It can also be considered that although reducing the diameter of this tube can make the radiator thinner, it is extremely difficult to manufacture

Method used

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  • Radiator and semiconductor laser device using and same semiconductor laser stack thereof
  • Radiator and semiconductor laser device using and same semiconductor laser stack thereof
  • Radiator and semiconductor laser device using and same semiconductor laser stack thereof

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Experimental program
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Embodiment Construction

[0026] The semiconductor laser lamination device of the present invention will be described with reference to the drawings. In addition, the semiconductor laser device and the heat sink of the present invention are included in the semiconductor laser lamination device of this embodiment.

[0027] First, the semiconductor laser lamination device in this embodiment will be described. figure 1 It is a perspective view of the semiconductor laser lamination device of this embodiment. The semiconductor laser lamination device 1 of the present embodiment, such as figure 1 As shown, it consists of three semiconductor lasers 2a-2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply pipe 5, a discharge pipe 6, four insulating members 7a-7d and three heat sinks 10a- 10c and constituted. Hereinafter, each constituent element will be described. In addition, for the convenience of explanation, the figure 1 The positive direction of the Z axis is called up, and the negativ...

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PUM

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Abstract

A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2a to 2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply tube 5, a discharge tube 6, four insulating members 7a to 7d, and three heat sinks 10a to 10c. Here, the heat sink 10a to 10c is formed by a lower planar member 12 having an upper face formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 having a lower face formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together.

Description

technical field [0001] The invention relates to a radiator used for heat dissipation of heating elements such as semiconductor devices, a semiconductor laser device and a semiconductor laser lamination device using the radiator. Background technique [0002] As a radiator for dissipating heat from a heat generating element such as a semiconductor device, for example, a radiator having a structure in which cooling water is circulated is known, as disclosed in JP-A-8-139479. The radiator includes a tubular supply channel for supplying pressurized cooling water, a discharge channel for discharging the cooling water, and a spray hole for spraying the cooling water supplied to the supply channel into the discharge channel. The cooling water sprayed at high pressure from the above-mentioned spray hole makes the heat-generating element installed directly above the spray hole dissipate heat efficiently. [0003] However, the heat sink of the above-mentioned prior art has the follow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473H01S5/024H05K7/20
CPCH01S5/02423H01L2924/0002H01S5/405H01S5/4031H01L23/473H01S5/02268H05K7/20254H01S5/02375H01L2924/00H05K7/20
Inventor 宫岛博文菅博文内藤寿夫太田浩一神崎武司
Owner HAMAMATSU PHOTONICS KK