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Micro-relay

A relay and electrode technology, applied in the field of microstructure, can solve the problems of reducing the miniaturization degree of relay products, and the inappropriate miniaturization of electromechanical relays.

Inactive Publication Date: 2004-10-27
TYCO ELECTRONICS LOGISTICS AG (CH)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional electromechanical relays are not suitable for easy miniaturization
For example, there is a limit to the size of the coil that can be reduced, which reduces the degree of miniaturization that can be exploited in relay products

Method used

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Embodiment Construction

[0015] The present invention relates to the fabrication of microstructures. In particular, the invention relates to relays formed from microstructures. The use of microstructures enables the production of miniaturized relays.

[0016] Figure 1A to Figure 1B They are respectively a cross-sectional view and a plan view of a micro relay according to an embodiment of the present invention. As shown, the relay includes a body 110 . The body includes a support element 160 . The support member is supported by the main body at the first end 163, forming a cantilever. The first contact area 133 is arranged near the support element second end 165 . The first contact area includes a first contact 131 .

[0017] A gap separates the top surface 168 of the support member from the surface 109 of the body, forming the cavity 121 . The cavity allows the support element to rotate about the first end 163 . The surface 109 includes a contact area 134 on which the second contact 130 is dis...

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PUM

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Abstract

A microstructure relay comprising an s-shaped support member is provided. The s-shape support member creater over-travel in the relay in order to produce high contact force and low contact resistance over the lifeting of the relay. Compressive and tensile stress-inducing layers on appropriate parts of the support member induce it to bend as desired.

Description

technical field [0001] This invention relates generally to microstructures, and in particular to relays and switches or valves formed from microstructures. Background technique [0002] Electronic relays are used in a wide variety of applications. These applications include, for example, selecting different conductive paths or switching circuits on or off. [0003] Generally, a relay includes a coil and a mechanical element for engaging or separating a pair of contacts. When the coil is energized, an electromagnetic field is generated to engage the contacts, forming an electrical connection. [0004] There is a current demand for miniaturization of consumer products such as electronics and communication products, which creates a corresponding need to reduce the size of relays. However, conventional electromechanical relays are not suitable for easy miniaturization. For example, there is a limit to the size of the coil that can be reduced, which re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B81B3/00B81C3/00H01H59/00
CPCH01H59/0009B81C1/00666B81C2201/0167H01L2924/0002H01L2924/00H01H59/00
Inventor 厄皮利·斯里达维克托·D·桑珀符芳涛德克·瓦格纳凯·克鲁普卡赫尔穆特·施拉克
Owner TYCO ELECTRONICS LOGISTICS AG (CH)