Circular arc flat-bottom cupped light emitting diode manufacturing method

A production method and technology of concave cups, which are applied to electrical components, electric solid devices, circuits, etc., can solve the problems of difficult heat dissipation and uneven light source, and achieve the effects of low heat generation, uniform brightness, and short time consumption

Inactive Publication Date: 2004-10-27
詹宗文
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For LEDs with this structure, when the aluminum bracket 11 is produced, it will also cause uneven light source due to eccentricity, and the most fatal defect of this structure is that it is not easy to dissipate heat. Since the operating temperature of the LED has an absolute relationship with its brightness, so , Whether the heat dissipation is good or not becomes an important basis for judging whether the LED is good or bad

Method used

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  • Circular arc flat-bottom cupped light emitting diode manufacturing method
  • Circular arc flat-bottom cupped light emitting diode manufacturing method
  • Circular arc flat-bottom cupped light emitting diode manufacturing method

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Embodiment Construction

[0072] Such as figure 2 As shown, the concave cup type LED 2 of the present invention uses a CNC computer drilling machine on the printed circuit board, and utilizes a milling cutter to drill an arc flat-bottomed concave cup 211 with an R angle at 12,000 to 25,000 revolutions, and the chip 22 is arranged on the circle. In the curved flat-bottom concave cup 211 , the chip 22 is connected to the copper foil on the printed circuit board 21 by wire bonding technology, and finally encapsulated on it with epoxy resin glue 23 . The concave cup of the present invention directly uses the printed circuit board to dissipate heat, and the contact thermal resistance is extremely low, so it has the advantages of long-term resistance to instantaneous high current, low heat generation, uniform brightness, high stability, reduced cost, and greatly increased production capacity.

[0073] The general LED operating temperature calculation method is as follows:

[0074] 1. With an electronic squ...

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PUM

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Abstract

A method for manufacturing a light emitting diode in the shape of cup with a curved surface and planar bottom comprises two stages: in first stage, to produce a printed circuit board in the shape of cup, a printed circuit board is placed in a drill and is drilled to a cup shape with a curved surface and planar bottom using a particular mill at 12000-25000 rpm, after the drilling of other circuit hole is completed, the interior of the cup is fully polished using a sandblast device, and then is plated with copper ion, then is plated nickel and gold; in second stage, to produce an LED in the form of cup, the printed circuit board produced thus is applied glue, then a chip is fixed on the printed circuit board, and then baking, bonding, testing, injecting glue and baking are performed successively, thereby forming an LED with the shape of cup. The LED manufactured according to the present invention shows good performances, commerciality and many uses.

Description

technical field [0001] The present invention relates to a kind of LCD manufacturing method of circular arc flat-bottomed concave cup, especially relates to a kind of can be applied to the surface adhesive light-emitting diode products, dot matrix light-emitting diode products, seven-segment display light-emitting diode products, LCD backlight board series products, automobile interior The manufacturing method of circular arc flat-bottom concave cup LED in the field of lighting and brake lamp series products, traffic sign lamp series products and outdoor full-color Kanban series products. Background technique [0002] LED is the English abbreviation of Light Emitting Diode (hereinafter referred to as LED), and the existing LED entities are as follows: figure 1 As shown, the LED 1 is connected to the aluminum bracket 11 with conductive wires, the aluminum bracket 11 passes through the printed circuit board 12 , and is soldered to the other side of the printed circuit board 12 ...

Claims

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Application Information

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IPC IPC(8): H01L25/075
CPCH01L2224/48091H01L25/0753H01L2224/48247H01L2224/48227
Inventor 詹宗文
Owner 詹宗文
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