Processing method for flexible-rigid board of high-pixel camera module

Abstract

The invention discloses a processing method for a flexible-rigid board of a high-pixel camera module. The processing method comprises the following steps of etching a plurality of flexible-rigid boardcircuits, arranged without gaps, on an original board to obtain a linkage board of the flexible-rigid board of the high-pixel camera module, and etching copper on a laser cutting path of the originalboard; enabling copper not to be laid at an inner layer and an outer layer on the laser cutting path; respectively etching laser cutting polarizers PAD at longitudinal terminals and transverse terminals needed to be cut by laser on the linkage board to prevent deviation during the laser cutting process; performing component surface mounting on the obtained linkage board; performing linear cuttingfrom a groove of the laser cutting polarizer PAD at one side to a groove of the laser cutting polarizer PAD at the other opposite side by UV laser until all the flexible-rigid boards are cut. Mechanical hard machining such as CNC rolling and die punching is not needed, the flatness is good, the machining process is simplified, the machining cost is reduced, and the utilization ratio of the original board is improved.

Description

technical field [0001] The invention relates to the field of processing circuit boards used in digital products such as mobile phones, tablets, and computers, in particular to a processing method for a high-pixel camera module flex-rigid board. Background technique [0002] The rigid-flex board used in the camera module must not only meet the ultra-thin, high-flatness functional structure, but also have the unique functions of the rigid-flex board, and it must also maintain good flatness after the components and chips are pasted. . As the carrier board of the camera of consumer electronics products, the function and performance of the rigid-flex board determine the quality of the entire product and the competitiveness of the enterprise, especially the flatness of the rigid-flex board has become a key factor affecting the imaging quality of the camera. COB packaging is chipOn board, which is to attach the bare chip to the interconnection substrate with conductive or non-cond...

AI Technical Summary

Problems solved by technology

It has the following disadvantages: 1. The processing process is long and there are many procedures, which seriously affects the yield and delivery time of the product

2. The hard board area adopts CNC gong shape, and the mold punching in the soft board area is mechanical hard processing, which greatly damages the flatness, and the thickness of the soft-hard combination board of the camera module

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