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Embedded internal storage test platform device and testing method

A technology for memory testing and platform devices, which is applied in semiconductor/solid-state device testing/measurement, electronic circuit testing, etc., and can solve problems such as inability to efficiently complete error detection, inability to perform rigorous testing of embedded memory, and time-consuming test samples, etc.

Inactive Publication Date: 2005-01-26
VIA TECH INC
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using common integrated circuit tester (IC tester) to perform the above-mentioned round-trip process of testing and modifying the design, it is time-consuming to compile test patterns separately.
Moreover, the test algorithms provided by the designers of static random access memory are not able to provide a comprehensive and rigorous test for embedded memory, so that many possible failure patterns cannot be detected and recorded Down, so that its testing and error checking procedures will take too long and delay the delivery time, resulting in heavy losses
[0005] The reason for this is that the test program executed on common integrated circuit tester (IC tester) and the functions that the hardware can provide are not test software and hardware developed for the purpose of debugging, so there is no It is the main purpose of the present invention to efficiently complete the error detection (debug) program required by the system integration single chip, and how to develop an appropriate and efficient test platform and error detection method, and then improve the defects of the above-mentioned common technical means

Method used

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  • Embedded internal storage test platform device and testing method
  • Embedded internal storage test platform device and testing method
  • Embedded internal storage test platform device and testing method

Examples

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Embodiment Construction

[0023] See figure 2 , The present invention is a functional block diagram of a preferred embodiment of an error detection test platform developed for defects in common means, which mainly includes an IC socket 20 under test, an independent memory integrated circuit 21, and a test The control circuit 22 can be jointly constructed on a circuit board 2. The tested integrated circuit socket 20 provides a system integration single-chip integrated circuit to be tested, and the independently arranged memory integrated circuit 21 selects a capacity greater than or equal to that of the system integrated single-chip integrated circuit to be tested. The memory capacity and operating behavior are consistent with the embedded memory, or even the better specifications, and the independently set memory integrated circuit has been tested and verified. As for the test control circuit 22 is coupled to the tested integrated circuit socket 20 and the independently provided memory integrated circuit 2...

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Abstract

The present invention relates to test platform set and its test method. It applies to system integration single chip with embedded internal storage. The set consists of a tested IC socket in which the system integration single chip is inserted, a reference IC socket in which can independent internal storage device is inserted, and a test control circuit connected to both the tested IC socket and the reference IC socket electrically. The test control circuit writes in comparable data to the tested embedded internal storage and the independent internal storage integrated circuits, then reads them out. When the read out data are not identical, it will stop writing in and reading out and send the wrong data to the computer to be recorded and analysed.

Description

Technical field [0001] The invention relates to a test platform device and a test method thereof, in particular to a test platform device and a test method applied to a system integration single chip with an embedded memory. Background technique [0002] Today's semiconductor integrated circuits mainly include a logic control circuit part and a memory part, and their functions and manufacturing methods are different, so they are generally fabricated on different chips. In industries with fine division of labor and their respective strengths, different professional teams usually produce the finished products before assembling them. However, with consideration of various factors such as cost, reliability, and execution speed, embedded chips, or so-called System On Chips (SOC) have become a trend. See figure 1 , A functional block diagram of a system integration single chip 1, which mainly has a logic control circuit 11 and an embedded memory 12, and the logic control circuit 11 an...

Claims

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Application Information

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IPC IPC(8): G01R31/28H01L21/66
Inventor 陈任凯郑兆成杜铭义林郁如曾千书
Owner VIA TECH INC
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