Surface emitting laser, photodiode, manufacturing method thereof and photoelectric mixed carrier circuit

Abstract

The invention provides a surface emitting laser and a photodiode both of which can be mounted firmly even when they are mounted by flip-chip bonding and can be modulated at high speeds, and to provide methods of manufacturing the laser and photodiode and a photoelectric combination circuit using them. In a semiconductor laminate laminated upon a semiconductor substrate, a light emitting section and reinforcing sections are formed with recessed sections between them and p- and n-type ohmic electrodes are respectively formed on the top faces of the reinforcing sections. The p-type ohmic electrode is buried in one of the recessed sections, is electrically connected to a p-type contact layer through a contact hole vertically formed in polyimide, and can supply a current to a light emitting section in the thickness direction of the section. In each recessed section, in addition, a groove section is formed to reach the substrate to suppress the parasitic capacitance generated between the electrodes.

Description

technical field [0001] The present invention relates to a surface emitting laser used in digital optical communication and a manufacturing method thereof. Background technique [0002] Generally, a Vertical Cavity Surface Emitting Laser (VCSEL: Vertical Cavity Surface Emiting Laser) is configured in such a way that the semiconductor laminate on which the active layer and the distributed reflection layer are stacked is etched in the vertical direction to form a convex light emitting part, and the laser beam is emitted from the The upper surface of the light emitting part has an opening formed on the light emitting surface to emit light. Here, in order to generate laser light, upper and lower electrodes sandwiched by insulating layers are formed on the semiconductor laminate including the light emitting part, and a current is supplied to the active layer by applying a voltage so that current flows in the thickness direction of the light emitting part. [0003] However, if the...

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Problems solved by technology

[0007] However, in the surface emitting laser with the above configuration, since the electrodes are laminated on the polyimide-based resin which is softer than the semiconductor material, deformation such as denting of the electrode surface may occur during mounting.

In this case, the electrode will be peeled off, and there is a problem that the surface emitting laser cannot be firmly mounted.

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