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Iron core coil structure for SMD and its manufacturing method

A technology of iron core coil and manufacturing method, which is applied in the direction of inductance/transformer/magnet manufacturing, transformer/inductor coil/winding/connection, inductance with magnetic core, etc., which can solve the problems of increased volume and height, complex manufacturing process, and cost High cost and other issues, to achieve the effect of improving flexibility, simplifying the manufacturing process, and reducing production costs

Inactive Publication Date: 2005-07-13
范云光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Commonly used iron core coil structure and its manufacturing method for SMD, as shown in Figure 1 (A), it is to plate the alloy of silver and palladium on the bottom surface of the iron core 811 in the form of electroplating, so that it becomes two conductive electrodes 812 , and fix the wire ends 821 wound around the iron core 81 and the two ends of the coil 82 by soldering, then it becomes an iron core coil structure 8 that can be used by SMD. The main disadvantage of its composition is: the price of silver and palladium is high , the treatment of electroplating wastewater is difficult, which makes the cost too high, and if the electroplating wastewater is not treated properly, the environment and ecology may be severely damaged
[0003] Also, another prior art related to the iron core coil structure 9 that can be used by SMD is to wind the formed iron core body 91 with the coil 92, and then glue a base with conductive electrodes 931 with AB glue. 93, as shown in Figure 1 (B) and (C), become an iron core coil structure 9 that can be used by SMD, although the iron core coil produced by this process can avoid the use of silver and palladium, but increases The base part is added, which makes the manufacturing process more complicated, and also increases the volume and height, and the cost cannot be effectively controlled
[0004] In view of the various shortcomings produced by the above-mentioned commonly used techniques, the applicant of the present invention once proposed the improvement of related technologies (please refer to the patent No. of the People's Republic of China: ZL 00 2 25482.4 patent case, as shown in Figure 1 (D)), this technology It is indeed effective to improve the shortcomings of the previous technology (such as mass production, cost reduction and public nuisance, etc.). Disadvantages, the application is applied to thin, light and small electronic products, and there are still difficulties in the use of limited space
[0005] It can be seen that the above-mentioned commonly used structure and its manufacturing process still have many shortcomings, and it is not a perfect design, but needs to be improved urgently.

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  • Iron core coil structure for SMD and its manufacturing method
  • Iron core coil structure for SMD and its manufacturing method
  • Iron core coil structure for SMD and its manufacturing method

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Embodiment Construction

[0024] Please refer to Fig. 2 (A) and (B), the iron core coil structure that can provide SMD use of the present invention, mainly is made of an iron core cylinder 1, two conductive sheets 2, two insulating seats 3 and a conductive coil 4 Constituted; the four end faces of the iron core cylinder 1 are surrounded by two mutually corresponding baffles 12a, 12b, so that an accommodating space is formed between the baffles 12a, 12b, and on the edge side of the two column ends, Each is provided with a slot 11, one end of the conductive sheet 2 is a contact terminal 21, and the other end is extended to form a conductive terminal 22, a fixed terminal 23 is vertically extended from the edge of the central side of the conductive terminal 22, and the conductive The end of the terminal 22 can be extended and bent as required to have a stopper 25, and the fixed terminal 23 on the central side of the conductive terminal 22 of the two conductive sheets 2 is fitted into the two-column end open...

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Abstract

An iron core coil structure for SMD and its manufacturing method. The left and right ends of the iron core cylinder are slotted, and the symmetrically formed conductive sheets at both ends of the lead frame are pre-installed at the fixed terminal position, and the packaging technology is used in the An insulating seat is formed at both ends of the iron core column, and the part of the iron core column that is not covered with the insulating seat is wound with a conductive coil and welded to the contact terminal or conductive terminal of the conductive sheet at both ends of the coil. That is to say, it becomes a wire-wound inductance element that can be used in surface mount technology (SMD), and the iron core coil manufacturing process provided by the present invention can not only simplify the complicated process steps of common techniques and carry out mass production, but also the present invention can be used in assembly When it is used, the planning of its installation space is more flexible.

Description

technical field [0001] The present invention relates to an iron core coil structure that can be used for SMD, especially a kind of iron core structure with slots at both ends and a lead frame structure that are matched with each other, and the manufacturing method is made by packaging technology and stamping technology. The technology of the iron core coil structure that can be used for SMD. Background technique [0002] Commonly used iron core coil structure and its manufacturing method for SMD, as shown in Figure 1 (A), it is to plate the alloy of silver and palladium on the bottom surface of the iron core 811 in the form of electroplating, so that it becomes two conductive electrodes 812 , and fix the wire ends 821 wound around the iron core 81 and the two ends of the coil 82 by soldering, then it becomes an iron core coil structure 8 that can be used by SMD. The main disadvantage of its composition is: the price of silver and palladium is high , the treatment of electro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/28H01F41/00
Inventor 范云光
Owner 范云光