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Controlled attenuation welding tool

A welding tool and end connection technology, which is applied in the direction of manufacturing tools, welding equipment, welding/welding/cutting items, etc., can solve the problems of not considering ultrasonic attenuation and dependence on height, etc.

Inactive Publication Date: 2006-04-19
KULICKE & SOFFA HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, conventional bonding tools have drawbacks because conventional bonding tool designs rely on the interconnect pitch and the height of the lead bonding ring without consideration for controlling the attenuation of ultrasonic waves

Method used

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Embodiment Construction

[0033] The present invention overcomes the deficiencies of conventional capillary bonding tools by altering the mass distribution along the length of the bonding tool. The resulting bonding tool requires less energy to form a bond on the substrate than conventional bonding tools. By a suitable design as discussed later, the direction of ultrasonic attenuation can be controlled and modified.

[0034] Ultrasonic welding tool design can be achieved by mathematically describing the motion of the tool driven by an ultrasonic transducer. Such a system is represented by a cantilever beam shown in equation (1):

[0035] Equation 1

[0036] ∂ 2 ∂ Z 2 [ EI ( Z ) ∂ 2 x ( z ...

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Abstract

A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the second cylindrical section having a substantially uniform second diameter less than the first diameter; and a third section having a predetermined taper, a first end of the third section coupled to an end of the second cylindrical section.

Description

technical field [0001] The present invention relates to a tool for bonding wires to semiconductor devices, and more particularly to a bonding tool with controlled attenuation characteristics. Background technique [0002] Modern electronic equipment relies heavily on printed circuit boards for mounting semiconductor chips or integrated circuits (ICs). The mechanical and electrical connection between the chip and the substrate poses great challenges to the chip designer. Three well-known techniques for attaching integrated circuits ICs to substrates are: wire bonding / bonding, tape automated bonding (TAB) and flip-chip. [0003] Of these methods, wire bonding is the most commonly used. In wire bonding, a plurality of bonding pads are positioned in a pattern on the top surface of the substrate, and a chip is mounted in the center of the pattern of bonding pads, with the top surface of the chip facing away from the top surface of the substrate. Fine wires (aluminum or gold wi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K20/00B23K20/10B23K101/38B23K101/42H01L21/60
CPCH01L2224/85205H01L2224/45015H01L2924/01014H01L2924/01074H01L2924/20752H01L24/85H01L2224/78301H01L2924/01029H01L2924/01039B23K20/005H01L2224/45147H01L2924/00014H01L2224/45144H01L2924/01013H01L2924/0104H01L2924/01005H01L2924/01082B23K2201/32H01L2924/01033H01L2924/01079H01L24/45H01L2924/01004H01L2224/73265H01L2924/01006H01L24/78H01L2224/78302H01L2224/78308B23K20/106H01L2224/45124H01L2924/14H01L2924/01023B23K2101/32H01L2224/78307H01L2224/48H01L2924/00H01L2924/00015H01L21/60
Inventor 阿米尔·米勒古尔·佩尔贝格
Owner KULICKE & SOFFA HLDG