Mechanical alloying preparation method of ceramic grain reinforced composite solder

Abstract

The invention is a mechanical-alloying preparing method of ceramic particle enhanced compound brazing filler metal, relating to a method of preparing compound brazing filler metal connected by fine ceramic material. It weighs the basal bodies of the brazing filler metal in weight percent: Ag powder 65-79%, Cu powder 22-35%, and Ti powder 3-10%; weighs the ceramic particles in a bulk of 3-25% of total bulk of the basal bodies and the diameter of a ceramic particle is 1-10 mum; placing the ceramic particles and the Ti powder in a planet ball mill for mechanical ball-milling, the diameter of a milling ball is 2mm-10mm, the ratio of ball materials is 10 :1-15 :1, the speed of the ball mill is 320r / min-400r / min, the vacuum is 0.1-5Pa and the ball changes the rotating direction once every 5-10min; the time for mechanical ball-milling is 2-7h; uniformly mixing the Ag and Cu powders with the mixed powder of the ceramic particles and the Ti powder. It has the advantages of good combination of the basal bodies with the ceramic particles, enhancing final mechanical performance of the brazing filler metal and the whole performance of the brazed joint.

Description

technical field [0001] The invention relates to a preparation method of composite brazing material used for connecting fine ceramic materials. Background technique [0002] The preparation of the existing ceramic particles reinforced composite solder is mainly to directly mix the ceramic particles with the powdery active solder, or spray the ceramic particles onto the surface of the foil-like active solder. During the brazing process, the active elements in the solder React with ceramic particles and ceramic base material respectively to achieve mutual bonding. For example, Si studied by Wendy B Hanson (Materials Technology.1999, 14(2): 53-56) of the British Welding Institute (TWI) 3 N 4 Ceramic particle reinforced composite brazing filler metal is Si 3 N 4 Ceramic particles are mixed with nitric acid alcohol, and the paste mixture is sprayed onto the surface of the foil-shaped Ag-Cu-Ti active solder through certain equipment to prepare a composite solder to connect Si ...

AI Technical Summary

Problems solved by technology

However, this method also has certain problems, among which the most prominent is that when the content of ceramic particles in the solder is relatively high, since the active elements are consumed by a large number of ceramic particle reinforcement phases, the bonding between the ceramic particles and the solder matrix often occurs. Poor performance and poor combination of composite solder and ceramic base metal, which leads to the decline of the performance of the entire joint