Surface acoustic wave device and production method thereof and mobile communication equipment using it

A surface acoustic wave and device technology, which is applied to machines/engines, electrical components, engine components, etc., can solve problems such as the increase in electrode specific resistance, the rise in chip temperature, and the stability of the electrical characteristics of SAW devices. The effect of higher electrical power performance

Inactive Publication Date: 2000-08-16
SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, since this structure adopts the lamination of Al and the second film made of a metal whose diffusion coefficient to aluminum is larger than that of aluminum, in the heating process after film formation, the Al and the second film Diffusion and alloying reactions between the metals, there is a problem that the specific resistance of the electrode increases due to this
The increase in the specific resistance of the electrode has a great influence o...

Method used

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  • Surface acoustic wave device and production method thereof and mobile communication equipment using it
  • Surface acoustic wave device and production method thereof and mobile communication equipment using it
  • Surface acoustic wave device and production method thereof and mobile communication equipment using it

Examples

Experimental program
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Effect test

Embodiment 1

[0047] (Example 1) Titanium was used for the first metal layer, and an alloy of Al-0.15% by weight Sc-1.0% by weight of Cu was used for the second metal layer.

Embodiment 2

[0048] (Example 2) An alloy in which titanium was added with 0.5% by weight of Al was used for the first metal layer, and an alloy of Al-0.15% by weight of Sc-1.0% by weight of Cu was used for the second metal layer.

[0049] Here, Sc contained in the second metal layer is a metal that dissolves in aluminum at room temperature, and Cu is used as a metal that segregates at grain boundaries of aluminum or forms an intermetallic compound with aluminum at room temperature.

[0050] Also, for comparison at the same time, the following SAW filter was fabricated according to the electrode structure of FIG. 2 .

Embodiment 3

[0072] (Example 3) Titanium was used for the first metal layer, and an alloy of Al-0.15% by weight Sc-1.0% by weight of Cu was used for the second metal layer.

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Abstract

The invention relates to the elastic surface acoustic wave device and production method thereof and mobile communication equipment using it. An electrode material for a elastic surface acoustic wave device comprising laminates in at least two stages, each laminate being formed by laminating a second metal layer (5) on a first metal layer (4), wherein the first metal layer (4) uses a metal having a diffusion coefficient to Al which is smaller than a self-diffusion coefficient of Al, and the second metal layer (5) uses a ternary or higher Al alloy in which at least two kinds of metals, at least one kind of metal solid-dissolved to Al at room temperature and at least one kind of metal which segregates in an Al grain boundary or forms an intermetallic compound with Al at room temperature are added, whereby a surface acoustic wave device excellent in power resistance, capable of using a conventional pattern forming technique, being thermally stable and preventing an insertion loss increase can be provided.

Description

technical field [0001] The present invention relates to a surface acoustic wave device with excellent electrical power resistance performance, in particular to a surface acoustic wave device with improved power withstand by electrodes, a manufacturing method thereof, and a mobile communication device using the device. Background technique [0002] In recent years, with the high frequency of mobile communication. The operating frequency of surface acoustic wave devices (hereinafter referred to as SAW devices: surface acoustic wave devices) is also developing towards higher frequencies ranging from hundreds of MHz to several GHz. In addition, due to the need to withstand relatively large power, studies have been conducted on the use of SAW devices in the filter portion of antenna duplexers using large dielectric filters in order to meet the demand for miniaturization of terminal equipment. Moreover, with the increase of operating frequency and operating power, the stress on t...

Claims

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Application Information

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IPC IPC(8): H03H9/02H03H9/145H03H9/64
CPCH03H9/14541H03H9/02929H03H9/6483
Inventor 高山了一古川光弘村嶋祐二樱川彻野村幸治
Owner SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN
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