Semiconductor laser device and optical pick-up apparatus using semiconductor laser device

Abstract

The present invention provides a semiconductor laser module which has a simple structure which is easy to assemble, which is easy to dissipate heat, and which can achieve high functionality and miniaturization at the same time. It has: a metal plate (100) whose width is roughly consistent with the larger of the width of the silicon substrate (120) and the width of the flexible thin plate (130), a semiconductor laser (110), integrated with a photodetection circuit and signal processing The silicon substrate (120), flexible thin plate (130), metal wire (140), and optical element (150) of the circuit, the flexible thin plate (130) is divided into two parts on the metal plate (100), and the Two flexible thin plates (130) face each other with a silicon substrate (120) in between.

Description

technical field [0001] The present invention relates to a semiconductor laser unit, and more particularly to a semiconductor laser unit constituting an optical pickup for recording to an optical disc such as a digital versatile disc (DVD) and a compact disc, and an optical pickup device using the same. (CD) and other recording media to write or read information. Background technique [0002] In recent years, CD series (CD-ROM, CD-R, CD-RW, etc.) and DVD series (DVD-ROM, DVD-RW, DVD-RAM, etc.) With the rapid popularization of the optical disc drive, the optical pickup device, which is the key part of the optical disc drive, with the high output for high-speed recording, the high function of the two standards of CD and DVD, and the thinning of the optical disc drive , while strongly demanding its miniaturization. Therefore, for the semiconductor laser unit used in the optical pickup device, heat dissipation improvement of the package for high output, multi-pin countermeasure...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that it is difficult to achieve both miniaturization and high functionality

Furthermore, the above-mentioned Japanese Patent Application Laid-Open No. 2003-67959 does not describe a semiconductor laser module having an optical element such as a diffraction grating. However, using the semiconductor laser assembly described in the above-mentioned Japanese Patent Application Laid-Open No. 2003-67959, there is a problem that the optical element cannot be bonded and fixed on the package.

[0019] In addition, in the semiconductor laser module described in the above-mentioned Japanese Patent Laid-Open No. 2002-198605, the light-emitting element and the photosensitive element are mounted on parts with different three-dimensional shapes, and a flexible thin plate is pasted on other parts. Therefore, there are complex processes and difficulties. The problem of shortening the working time and making it difficult to ensure positional accuracy

Furthermore, the terminal portion of the flexible thin plate for electrically connecting the light-emitting element and the photosensitive element by wire bonding, such as image 3 As shown, after being bent, it is pasted on a metal contact, so there is a problem that the operation becomes complicated and it is difficult to maintain the adhesive strength

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