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Design and manufacture of low-inductance bus

A low-inductance busbar and negative busbar technology, applied in busbar/circuit layout, output power conversion devices, electrical components, etc., can solve complex methods, it is difficult to ensure long-term reliable operation of the inverter, reduce low-inductance Busbar etc.

Inactive Publication Date: 2006-08-02
CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Some low-sensitivity busbars can only be used in low-voltage occasions due to their rudimentary structural design. However, when the working voltage between busbars is higher than 1500VDC, it is difficult to ensure that the inverter can work reliably for a long time
[0004] 2. Although some low-sensitivity busbars are compact and reasonable in design and beautiful in appearance, the method of making these low-sensitivity busbars is often complicated, which not only requires special processing molds, but also ensures that they are installed in high-voltage situations The IGBT components can ensure that there is a long enough creepage distance between the C and E poles, and often have to make major changes to the design of the low-inductance busbar, or even reduce the basic principle of the structural design of the low-inductance busbar: make the positive and negative busbars The shape and area of ​​the two rows are quite different
As a result, the distributed inductance of the low-inductance busbar increases, but this increases the difficulty of the main circuit design

Method used

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  • Design and manufacture of low-inductance bus
  • Design and manufacture of low-inductance bus
  • Design and manufacture of low-inductance bus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] attached figure 1 , 2 For the given low-sensitivity busbars, the positive and negative busbars are made of electrolytic copper plates or aluminum plates less than 2mm, and the intermediate insulation layer is insulated by epoxy boards FR4 or flexible substrates (such as LPE3'-FR) less than 1.5mm Composed of materials, the outer insulating layer is composed of epoxy board under 2mm; the connection between the low-sensitivity busbar and the IGBT components is carried out through conductive copper columns riveted on the positive and negative busbars; each adjacent two layers Prepregs that act as a bond are stacked between

[0033] (7): At the same time, an insulating plug 6 is added between the positive and negative busbars and the conductive copper column.

[0034] The above-mentioned low-sensitivity busbar adopts the method of adding insulating plugs in the structural form, and makes full use of the glue flow characteristics of the prepreg to fully bond the insulating ...

Embodiment 2

[0035] Embodiment 2 (see attached image 3 , 4 ) and Example 3 (see attached Figure 5 , 6 )

[0036] These two embodiments are actually two improvements to Embodiment 1, and their common purpose is to increase the creepage distance between C and E poles. Wherein the method that embodiment 2 adopts is the way that does not increase any additional accessories, promptly mills out a certain number of small grooves 8 on the outer layer insulating layer 4, makes collector, emitter two poles by these 2-5 small grooves The creepage distance between them is moderately increased.

Embodiment 3

[0037] Embodiment 3 is to add a raised creepage isolation plate 9 on the outer insulating layer 4 between the collector and the emitter poles, and to pass through the isolation plate 9 or additionally add a small milling plate on the isolation plate 9. The groove 8 increases the creepage distance between the collector and the emitter (of course, the increased creepage distance of this solution is greater than that of Embodiment 2).

[0038] It is due to the adoption of the attached image 3 , 4 And attached Figure 5 , 6 These two improvements enable the busbar to expand the creepage distance between the collector and the emitter without changing the specification and shape, so that the busbar can be used in applications with a working voltage greater than 1500VDC.

[0039] The specific production methods of the low-sensitivity busbars shown in the above examples 1-3 should be as follows: blanking - drilling, milling, punching and bending processing - riveting welding - cle...

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PUM

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Abstract

A low-inductance multi-layer bus bar for the reverse converter is composed of conducting copper rod with positioning function, external insulating layer, positive copper bars, intermediate insulating layer, negative copper bars and external insulating layer, a features that insulating block is inserted between conducitng copper rod and bus bar, the adhesive semisolidified sheet is between adjacent layers, and the tracking structure for increasing tracking distance is attached to external insulating layer. It is made up through blanking, drilling, milling, punching, bending, rivetting-welding, cleaning, electroplating, stacking, and hot pressing.

Description

technical field [0001] The invention relates to a low-sensitivity busbar and a design and manufacturing method of the busbar, and belongs to the manufacturing method of inverter auxiliary parts. Background technique [0002] In the engineering design of medium and large-capacity IGBT inverters, it is very important to arrange busbars reasonably and reduce distributed inductance to protect IGBT components from transient overvoltage breakdown. Therefore, it has become one of the key technologies for the main circuit design of the IGBT inverter to seek the structural design and manufacturing method of the low-inductance busbar less than 100nil. Although the existing various low-inductance busbars (BuIsbar) can meet the basic requirements of the main circuit structure design of the IGBT inverter, they also have the following deficiencies: [0003] 1. Some low-sensitivity busbars can only be used in low-voltage occasions due to their rudimentary structural design. However, when ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02B1/20H01B5/02H02M1/00
Inventor 李小红忻力荣智林陈燕平翁星方
Owner CSR ZHUZHOU ELECTRIC LOCOMOTIVE RES INST
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