Semiconductor laser device and manufacturing method thereof
A technology for laser devices and manufacturing methods, which is applied to semiconductor lasers, laser components, lasers, etc., and can solve problems such as reducing the maximum light output and reliability degradation
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no. 1 example
[0080] FIG. 1 is an explanatory diagram showing the structure of a semiconductor laser device according to a first embodiment of the present invention. In FIG. 1, FIG. 1(a) shows a perspective view including the light exit end face, and FIG. 1(b) shows the waveguide path in the layer thickness direction taken from the line Ia-Ia' of FIG. 1(a). The cross-sectional view, and Fig. 1(c) shows a cross-sectional view in the layer thickness direction, taken along the line Ib-Ib' of Fig. 1(a)*. Reference numeral 101 is an n-type GaAs substrate, 102 is an n-type GayInzP buffer layer (where y and z are each set from not less than 0 to not more than 1; this description is omitted hereinafter), and 103 is an n-type Al x Ga y In z P first covering layer (x, y and z are respectively set from not less than 0 to not more than 1; hereinafter, this description is omitted), 104 is an active layer (MQW active layer), and in this layer, alternately The double quantum well structure formed by th...
no. 2 example
[0119] With respect to the semiconductor laser device of the present invention described in the first embodiment, this embodiment discusses the concentration of As atoms and the wavelength in the window region relative to the second conductivity type as the second conductivity type in the region near the end facet of the laser resonator. p-type Al x Ga y In z P The relationship between the bit weight of the wavelength in the active region in the second cladding layer 105 .
[0120] In the manufacturing method described in the first embodiment, the irradiation amount (dose) of ionized As atoms is changed so that the p-type Al as the second cladding layer of the second conductivity type in the region near the end face of the laser resonator x Ga y In z The concentration of As atoms in the P second cladding layer 105 is set to 1×10 17 cm -3 , 5×10 17 cm -3 , 1×10 18 cm -3 , 5×10 18 cm -3 , 1×10 19 cm -3 , 5×10 19 cm -3 , 1×10 20 cm -3 , 5×10 20 cm -3 and 1×10 ...
no. 3 example
[0132] With respect to the semiconductor laser device of the present invention described in the first embodiment, this embodiment discusses the p-type Al contained in the second cladding layer as the second conductivity type x Ga y In z P second cladding layer 105 and p-type Al x Ga y In z P in the third cladding layer 107 has a concentration of impurity atoms (Be atoms) having the second conductivity.
[0133] In the manufacturing method described in the first embodiment, on seven n-type GaAs substrates 101, the respective thin layers 102 to 108 are successively formed by epitaxial growth by the MBE method, so that seven values of 5.0×10 17 cm -3 , 7.5×10 17 cm -3 , 1×10 18 cm -3 , 2.5×10 18 cm -3 , 5×10 18 cm -3 , 7.5×10 18 cm -3 , and 1×10 19 cm -3 Each value in is set to p-type Al as the second capping layer of the second conductivity type x Ga y In z P second cladding layer 105 and p-type Al x Ga y In z P is the concentration of impurity atoms (Be...
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