Film removing apparatus, film removing method and substrate processing system

Abstract

A film removing device, comprising a substrate holding part (60) for holding a substrate having coated film, a laser beam source (63) for partially peeling off the coated film from the substrate by locally radiating laser beam at an alignment mark position (14) on the substrate placed on the substrate holding part, a fluid feed mechanism (113 to 116, 201, 202) having main nozzles (64, 172, 200) for feeding specified fluid to the alignment mark position, a collecting mechanism (90) having sucking ports (66a, 171, 193) for sucking, on the substrate, the specified fluid fed to the alignment mark position together with peeled film components, and guide members (65, 170, 191) for guiding the specified fluid jetted from the main nozzles to the alignment mark position and guiding the fluid to the sucking ports of the collecting mechanism so that the specified fluid and peeled film components do not diffuse nor leak to the periphery of the alignment mark position.

Description

technical field [0001] The present invention relates to a film removing device, a film removing method, and a substrate processing system for removing a coating film such as a protective film and an antireflection film from a positioning mark for substrate positioning. Background technique [0002] The photolithography process (Photolithography process) for manufacturing LCD or semiconductor devices is carried out in the following order: a protective film coating process for coating a protective liquid on the surface of a substrate (glass substrate for LCD, semiconductor wafer), and forming a specified surface on the protective film. The exposure treatment of the latent image pattern and the development treatment of developing the protective film. Thus, a prescribed circuit pattern is formed on the substrate. [0003] In terms of exposure processing, the exposure machine must position the substrate with high precision. The steps of substrate positioning are as follows: make...

AI Technical Summary

Problems solved by technology

However, even with such a microfabrication device, it is still impossible to eliminate the possibility that the decomposed products of the film once removed will adhere to it again.

Still not enough to prevent contamination of the substrate

In addition, since the entire substrate is stained with liquid, post-processing requires a cleaning mechanism to clean the entire substrate, so there is a disadvantage that the processing process is complicated.

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