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Multi-diameter solder ball automatic releasing device

An automatic feeding and multi-specification technology, which is applied in the direction of welding equipment, electrical components assembly of printed circuits, electrical components, etc., can solve the problems of inconvenient automatic ball planting, achieve automation and flexibility, powerful functions, increase flexibility and convenience effect

Inactive Publication Date: 2007-04-25
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device proposed in this patent can only put solder balls of one diameter specification, but in the application of CSP / BGA chip packaging or rework, the specifications of solder balls are various, and the original device cannot solve multiple problems with one set of devices. Chip packaging and rework of various specifications of solder balls; the original design is mainly used for manual ball planting, which is inconvenient to realize automatic ball planting

Method used

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  • Multi-diameter solder ball automatic releasing device
  • Multi-diameter solder ball automatic releasing device
  • Multi-diameter solder ball automatic releasing device

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Embodiment Construction

[0022] As shown in FIG. 1 , the present invention includes: a ball storage bin 1 , a bracket 2 , a stepped turntable 3 , a ball output base 4 and a driving element 18 . The ball storage bin 1 is arranged on the bracket 2, the driving element 18 is installed under the ball outlet base 4 through the connecting piece, the stepped turntable 3 and the driving element 18 are connected through the connecting piece, and the stepped turntable 3 is arranged on the bracket 2, the ball outlet between the bases 4, and the stepped turntable 3 is located in the ball-out base 4, and the bracket 2 and the ball-out base 4 are connected together through connecting pieces.

[0023] As shown in FIG. 2 and FIG. 3 , the ball storage bin 1 has an eccentric material hole 5 corresponding to each type of solder ball with a diameter to be dropped. Each eccentric material hole 5 is composed of an upper chamfer and a lower cylindrical part, which is convenient for storing more solder balls and can form a c...

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Abstract

It is a multi-diameter wielding ball auto throw device, which comprises ball store, bracket, step disc and ball-out socket and drive part. The ball store has the relative bias hole to each wielding ball; the bracket is opened with relative hole in each bias hole of the store; the step disc are evenly distributed with relative wielding ball holes with connected holes and groove in the center; the ball-out top is set with down slide groove and one bias material-out hole relative to the step disc.

Description

technical field [0001] The invention relates to a welding ball delivery device, in particular to an automatic delivery device for welding balls with multiple specifications and diameters. Used in the field of printed circuit and electronic component packaging. Background technique [0002] In the field of electronic packaging and assembly, Chip Scale Package (CSP) and Ball Grid Array (BGA) technologies have been widely used. Whether it is in the production process of CSP or BGA devices, or in the repair process of damaged CSP or BGA devices, the problem of implanting solder balls for soldering processing will be encountered. At present, in the process of medium and small-scale production and CSP / BGA device rework, the method of mass-production overall ball planting will increase additional costs and processes, such as the need to make special templates and re-adjust equipment, etc. It does not meet the flexible production requirements and is very uneconomical. [0003] Af...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H05K3/30B23K31/00
Inventor 熊振华王禹林丁汉
Owner SHANGHAI JIAOTONG UNIV