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Device and method for cooling heat source in high density chip carrier equipment

A heat-absorbing device and heat source technology, which is applied to household refrigeration devices, cooling/ventilation/heating transformation, coolers, etc., can solve problems such as large fluid resistance, inability to deform, and ineffective heat transfer

Inactive Publication Date: 2002-06-26
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the configuration of this wick structure is arbitrary, the fluid resistance is high, it is ineffective for heat transfer to the fluid, and it cannot be deformed, so the use of this wick structure is limited to rigid applications.

Method used

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  • Device and method for cooling heat source in high density chip carrier equipment
  • Device and method for cooling heat source in high density chip carrier equipment
  • Device and method for cooling heat source in high density chip carrier equipment

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Embodiment Construction

[0015] FIG. 1 is an exemplary block diagram illustrating the basic operation of a heat pipe. As shown in FIG. 1 , the function of the heat pipe is to transfer heat from a heat source 110 to a heat sink 120 . Heat from heat source 110 is transferred to cooling liquid 130, which is converted into steam by the heat. The steam travels along the heat pipe 140 from the steam chamber 150 to the condenser chamber 160 where it transfers heat to the heat sink 120 and as a result, the vapor turns back into a liquid.

[0016] The liquid condensed in the condenser chamber 160 is returned to the vapor chamber 150 by the capillary force of the material constituting the heat pipe structure. For example, a heat pipe may be constructed of a porous glass material (represented by a length of wall with circular apertures). These small holes in the glass material provide passages through which cooling fluid can return to the vapor chamber 150 . Capillary force enables the cooling liquid to retur...

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PUM

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Abstract

A thermoelectric coolers apparatus for dense chip packaging device is provided. The apparatus includes an evaporator region, a condenser region, and a capillary region. The evaporator region includes one or more hot point elements used to transfer heat from a heat source to a transport fluid. The transport fluid changes state to a vapor when heat is applied to the transport fluid. The vapor travels to the condenser region via vapor channels and is condensed to a fluid once again by transferring heat from the vapor to a heat sink. The condensed fluid is then returned to the evaporator region by way of capillary forces and capillaries formed in a capillary structure. The capillaries formed in the capillary structure have a tree-like or fractal geometry. The apparatus may further include a flexible region that allows the apparatus to be bent around corners and edges.

Description

technical field [0001] The present invention relates to high density chip packaging equipment using heat pipes and thermoelectric coolers, and more particularly to apparatus and methods for cooling heat sources in such equipment. Background technique [0002] Increasing the power density of electronic circuits requires improvements in the systems that conduct heat away from the circuits. Power density increases with the level of integration and speed of operation, so as electronic circuits become more integrated and speeds of operation increase, the need to conduct heat away from the circuit becomes very important. [0003] Heat pipes help improve heat removal from integrated circuits. Micro heat pipes use small tubes filled with a working fluid to transfer heat away from high temperature components. These pipes are generally straight channels cut or drilled in a surface. The heat is carried away through the pipes by the evaporation and condensation of...

Claims

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Application Information

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IPC IPC(8): F25B23/00F25D19/00F28D15/02F28D15/04H01L23/38H01L23/427H05K7/20
CPCH01L2924/0002H01L23/427F28D15/0233F28D15/04F28F2210/02F25D19/006F25B23/006H01L23/38H01L2924/00H05K7/20
Inventor 龙塔姆·S·霍沙尔
Owner IBM CORP