Adaptive 2-hoop fibre array load and its preparing process

An adaptive, pinching technology, applied in the direction of electrical components, plasma, etc., can solve the problems of destroying the specific distribution of the wire array load wire, unsuitable load, large contact resistance, etc., and achieves easy installation and removal, easy assembly, The effect of small contact resistance

Inactive Publication Date: 2002-09-18
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the Z-pinch physical experiment site, the wire array load is fixed on the cathode and anode electrodes, and a rapid inward pinch is generated under the action of high current to form a uniform plasma shell. However, since the target chamber is evacuated, it is located in between The distance between the negative and positive electrodes will change, and the load wire itself is very thin and soft (diameter<100μm), unable to support and overcome this change, so that the load wire array located between the negative and positive electrodes bends and deforms, destroying the wire Specific distribution of array-loaded filaments, affecting Z-pinch physical experiment results
In order to overcome the adverse effects caused by this change, most of the load wires are suspended from each load wire at the lower end of the load wire array

Method used

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  • Adaptive 2-hoop fibre array load and its preparing process
  • Adaptive 2-hoop fibre array load and its preparing process
  • Adaptive 2-hoop fibre array load and its preparing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] From figure 1 It can be seen that the embodiment of the present invention is a cylindrical single-layer self-adaptive Z-pinch wire array load.

[0033] Positioner a2, positioner b3 and auxiliary positioning plate 4 are made of brass disc material; one side of positioner b3 is processed into a coaxial cylindrical step, and the diameter of the step is smaller than the outer diameter of positioner b3.

[0034] The axial center of locator a2, locator b3 and auxiliary locating disc 4 are processed with threads of the same pitch along the axial direction, and a keyway 12 is processed along the axial direction; Cut out the same number of slits 5 evenly distributed on the respective circumferences.

[0035] The compression ring 10 has a diameter smaller than the outer diameter of the locator b3, slightly larger than the diameter of the step of the locator b3; the elastic size of the spring 6 matches the strength of the load wire 1 loaded by the wire array; the locator a2, the ...

Embodiment 2

[0041] figure 2 It is a schematic diagram of the load structure of the parallel multi-filament self-adaptive Z-pinch wire array of Embodiment 2 of the present invention.

[0042] The auxiliary device system with two support rods 7 is adopted, and no steps and compression rings 10 are arranged on the positioner b3, and no wire 9 is used for connection, and the rest are the same as the above-mentioned embodiment 1.

Embodiment 3

[0044] The slit 5 is replaced by a small hole, and the load wire 1 is connected through the small hole, and the rest is the same as the above-mentioned embodiment 1.

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Abstract

The invention discloses a self-adapting typed Z-pinch wire matrix load and its preparing method. Fixing connecting spring, support bar, key-groove and key-bar etc. between the asistant location plateand localizer of the wire matrix load makes the wire matrix load automatically adapt change of space between electrodes of target. The invention solves several issues of the wire matrix load preferably such as deformation, difficult to install and improves performance of electric contact between load wire and localizer. It is convenient for assembly, adjustment, storage and transport of the wire matrix load.

Description

1. Technical field [0001] The invention belongs to the field of pinch devices for generating plasma, and in particular relates to an adaptive Z-pinch wire array load and a preparation method. 2. Background technology [0002] There are many structures and types of wire array loads used in Z-pinch physics experiments, including single wire load and multi-wire load. The wire arrays are further divided into single-layer cylindrical wire arrays and coaxial multi-layer cylindrical wire arrays. Regardless of the structure of the wire array load, they are all composed of load wires with uniform diameters arranged according to the requirements of physical experiments. In the Z-pinch physical experiment site, the wire array load is fixed on the cathode and anode electrodes, and a rapid inward pinch is generated under the action of high current to form a uniform plasma shell. However, since the target chamber is evacuated, it is located in between The distance between the negative an...

Claims

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Application Information

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IPC IPC(8): H05H1/00H05H1/06
Inventor 邱龙会唐永建傅依备魏芸孙祚科
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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