Manufacture of semiconductor ceramic capacitor with crystal interface layer
A technology for ceramic capacitors and manufacturing methods, applied in capacitor manufacturing, capacitors, fixed capacitor dielectrics, etc., can solve the problems of high requirements for preparation technology and equipment, high requirements for sintering temperature, and high production costs, and meet the requirements of preparation technology and equipment. The effect of reducing, excellent dielectric performance parameters, and reducing production costs
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[0016] The method for manufacturing a grain boundary layer semiconductor ceramic capacitor of the present invention, the specific implementation method is completed in sequence according to the following steps:
[0017] ①According to the formula: 1mol of SrCO 3 , 1mol TiO 2 , 0.007mol Nb 2 o 5 Prepare briquettes.
[0018] ② Planetary ball milling for 8 hours to achieve a particle size of <1um.
[0019] ③ Calcined at a temperature of 1160 ° C to form the main crystal phase SrTiCO 3 .
[0020] ④According to the formula in the above-mentioned calcined powder: every 100g of SrTiCO 3 Add 0.4g of MnCO 3 And 5g of flux PbO, Bi 2 o 3 , B 2 o 3 , CuO.
[0021] ⑤Ball milling for 24 hours, particle size <1um.
[0022] ⑥ Mix 20g of polyvinyl alcohol solution per 100g of ball-milled ceramic material, and then roll the film into a 0.35mm thick sheet. Punch 5.5mm.
[0023] ⑦ Stamping into Φ5.5mm wafer blank.
[0024] ⑧The wafer blank is processed by debinding.
[0025] ⑨Plac...
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