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Coating device and method for controlling film thickness to realize uniform film thickness

A technology of spraying device and film thickness, applied in spraying device, device for coating liquid on the surface, coating equipment for photoengraving process, etc., can solve problems such as loss of spraying device

Inactive Publication Date: 2003-01-22
NEC ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a spraying device requires a relatively long time for testing, thereby causing losses in the operation of the spraying device

Method used

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  • Coating device and method for controlling film thickness to realize uniform film thickness
  • Coating device and method for controlling film thickness to realize uniform film thickness
  • Coating device and method for controlling film thickness to realize uniform film thickness

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Experimental program
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Embodiment Construction

[0020] Such as figure 1 Shown, according to the spraying device of the present invention comprises: spraying unit 10, it is used for photoresist is sprayed on the semiconductor wafer 40; Control unit 20, it is used for controlling spraying unit 10; And thickness measuring unit 30, it is used for The film thickness of the photoresist sprayed onto the semiconductor wafer 40 was measured.

[0021] The coating unit 10 includes a turntable 11 for fixing the semiconductor wafer 40 , a motor 12 for rotating the turntable 11 , and a dropper 15 for dropping photoresist onto the semiconductor wafer 40 . The spraying unit is generally placed in a closed space. The spraying unit 10 sprays the photoresist on the semiconductor wafer 40 using a spin spraying method. The photoresist is dropped from the dropper 15 onto the rotating semiconductor wafer 40 and uniformly spreads on the semiconductor wafer 40 to form a photoresist film, and then the photoresist is dried. In addition to the moto...

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PUM

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Abstract

An applying apparatus includes an applying unit for applying a photoresist to a semiconductor wafer on the basis of an applying condition, a thickness measuring unit for measuring the film thickness of the photoresist applied, and a control unit for controlling the applying unit. On the basis of information on the applying condition for a predetermined number of samples and information on the film thickness on the predetermined number of samples, the control unit plots an approximate curve that indicates the relation between the film thickness and the applying condition of the predetermined number of samples. When the applying apparatus starts its actual operation, the control unit calculates a correction value of the applying condition from a thickness target value on the basis of the plotted approximate curve, and generates a control signal for controlling the applying condition on the basis of the calculated correction value.

Description

technical field [0001] The invention relates to a spray coating device and method for controlling film thickness to spray uniform photoresist on a semiconductor wafer. Background technique [0002] During the lithography process used to manufacture semiconductor devices, photoresists are sprayed onto semiconductor wafers. So far, various improvements have been proposed to ensure uniform film thickness of the photoresist. The unevenness of film thickness is required to be limited to about several tens of micrometers or less. [0003] In order to ensure that the photoresist achieves a uniform film thickness, the following spraying devices have been proposed. The device includes a spraying unit and a thickness control unit. The spraying unit sprays the photoresist on the semiconductor wafer by a spin spraying method. The thickness control unit controls a rotation motor for rotating the semiconductor wafer, and includes a thickness measurement device and a feedback control s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C11/00B05C11/02B05C11/08B05D1/40B05D3/00G03F7/16H01L21/00H01L21/027
CPCB05B12/084G03F7/162H01L21/67253B05C11/08B05C11/02H01L21/027
Inventor 岛根誉
Owner NEC ELECTRONICS CORP