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High-frequency switch module

A high-frequency switch and switching element technology, applied in high-frequency matchers, sustainable manufacturing/processing, final product manufacturing, etc., can solve problems such as increased signal loss, increased cost, and lack of electrical characteristics

Inactive Publication Date: 2003-01-29
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the size of the cellular phone is increased and the cost is increased
However, if a high-frequency switch and a SAW filter are combined, the loss of the transmission signal increases in the transmission path from the transmission circuit to the antenna, and the desired electrical characteristics cannot be obtained.
In addition, no attempt has been made so far to balance a part of the high-frequency circuit constituting the high-frequency switch

Method used

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Embodiment Construction

[0083] figure 1 Showing an example of the circuit of the high frequency switch module of the present invention, figure 2 show figure 1 An example of the equivalent circuit of the high-frequency switch module. In this high-frequency switch module, a phase correction circuit LD4 is disposed between the high-frequency switch SW and the SAW filter f2, and these components are combined.

[0084] As a result of examining the combination of the high-frequency switch SW and the SAW filter, it was found that if only the impedance matching at the connection point between the high-frequency switch SW and the SAW filter connected to the receiving circuit side is considered, the transmission from the transmitting circuit Signal loss increases. Therefore, taking a high-frequency switch module that combines a high-frequency switch for GSM1800 and a SAW filter without a phase correction circuit as an example, the insertion loss characteristics between the transmission circuit TX and the...

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Abstract

A high-frequency switch module which comprises a high-frequency switch circuit connected among an antenna, a transmission circuit, and a reception circuit and comprising switching elements and a surface acoustic wave filter connected between the high-frequency switch circuit and the reception circuit, uses a laminate constituted of dielectric layers having electrode patterns as the multilayered board, and has a phase correction circuit disposed between the switch circuit and the surface acoustic wave filter, wherein the high-frequency switch circuit comprises a switching element, a transmission line, and a capacitor as main elements, with at least a part of the transmission line and the capacitor constituted of an electrode pattern in the laminate, and with the surface acoustic wave filter mounted on the laminate.

Description

technical field [0001] The present invention relates to a high-frequency switch module used in a high-frequency band such as a microwave frequency band, and particularly relates to a high-frequency switch module in which a high-frequency switch and other high-frequency components such as a filter are combined. Background technique [0002] Recently, the development of mobile communication devices such as cellular phones has been remarkable. As high-frequency components used in mobile communication equipment, there are high-frequency switches for switching the connection between the antenna and the transmission circuit, and the connection between the antenna and the reception circuit. [0003] For example, the high-frequency switch disclosed in (Japanese) Patent Laid-Open No. 2-108301 supports, for example, one of EGSM900 (Extended Global System for Mobile Communications, extended global system for mobile communications), GSM1800, PCS (Personal Commu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/15H03H7/075H03H7/42H03H7/46H03H9/25H03H9/64H04B1/40H04B1/44H04B1/48H05K1/00H05K1/02H05K1/03H05K1/16H05K1/18
CPCH05K1/162H03H7/465H05K1/0243H05K2201/1003H05K1/181H05K2201/10083H05K1/0306H05K1/0237H05K1/0298H04B1/406H04B1/48Y02P70/50H04B1/50
Inventor 釰持茂渡辺光弘深町启介但井裕之横内智
Owner MURATA MFG CO LTD