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Process and apparatus for low oxygen and low moistness packing

A low-humidity, confined space technology, applied in packaging, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the problems of functional failure, separation, insufficient and good welding area of ​​preserved objects, etc.

Inactive Publication Date: 2003-12-31
KING YUAN ELECTRONICS +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

What's more unfortunate is that the two seem to be bonded together, but there is actually not enough and good welding area, as long as a little stress will cause separation (bond lift)
[0005] On the other hand, many electronic parts or precision instruments will also be damaged by the intrusion of moisture, or an insulating oxide layer will be formed on the metal contacts.
All in all, if the oxygen and moisture in the wafer cassette or container are not excluded, there is still a potential oxidation problem that will cause the function of the preservation to fail

Method used

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  • Process and apparatus for low oxygen and low moistness packing
  • Process and apparatus for low oxygen and low moistness packing
  • Process and apparatus for low oxygen and low moistness packing

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Embodiment Construction

[0028] figure 1 It is a working flow diagram of the low oxygen and low humidity sequestration method of the present invention. According to step 11, put a wafer box loaded with wafers or a container for storing articles into a closed space, it is worth noting that the upper cover of the wafer box or container must be opened, so that the wafer box or container and the inside of the closed space Gases can be exchanged freely. After confirming that the airtightness of the confined space is correct, the vacuum state is established, as in step 12. Generally, the negative pressure reaches about 6 atmospheres, which means that the vacuum degree has met the operating standard, as in step 13. If the degree of vacuum is insufficient, it is necessary to continue to remove the remaining air in the confined space, otherwise, enter the next step 14 to perform nitrogen filling. In this step, nitrogen with a purity of more than 99% is poured into the confined space to fill the entire space ...

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Abstract

The invention discloses a low oxygen content and low humidity process and apparatus for long term storage of oxidizing article and precision instrument, characterized by exhausting the air in the article storing container and filling with nitrogen of over 99% concentration, thus resulting the low oxygen content and low humidity in the storage space, preventing the metal portion of the protected article from the oxidizing corrosion.

Description

technical field [0001] The invention discloses a low-oxygen and low-humidity storage method and its device, in particular to a storage method for long-term storage of easily oxidized articles or instruments and a device for implementing the method. Background technique [0002] In the circuit manufacturing process of semiconductor wafers, in order to increase the transmission speed of the wafers between machines and to avoid the contamination of the wafers by particles in the air during the transmission process, it is necessary to store multiple wafers in one Carriers for transport in wafer cassettes. The chips that have completed the circuit production still need to be stored in the chip box, and then sent to the testing factory and packaging factory for subsequent related processes after being instructed. [0003] The sales and demand market of the electronics industry often fluctuates due to many unpredictable factors. Therefore, it is necessary to temporarily place the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/86H01L21/00H01L21/68
Inventor 蔡英杰江燕玲
Owner KING YUAN ELECTRONICS
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