Production method of film circuit plate

A technology of thin-film circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, electrical components, etc., and can solve problems such as high defective rate, complicated manufacturing steps, and increased manufacturing costs

Inactive Publication Date: 2004-02-25
ZIPPY TECH
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] When making this kind of thin film circuit board with jumpers, not only are there many printing processes, but the relative production steps are complicated, which increases the production cost, reduces the relative output, and the rate of defective products is also high. The proportion of micro-short circuit is high, the reliability of the product is poor, and the printed jumper will cause uneven thickness of the thin film circuit and affect the key in (key in)
[0005] In addition, when the keyboard m...

Method used

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  • Production method of film circuit plate
  • Production method of film circuit plate
  • Production method of film circuit plate

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Embodiment Construction

[0015] see figure 2 , 3 , is a schematic diagram of key position distribution and thin film circuit board of the present invention. As shown in the figure: the manufacturing method of the thin film circuit board of the present invention is mainly carried out under the condition that the thin film circuit board does not jump wires and avoids the generation of unknown key signals when the thin film circuit board is arranged or arranged (Membrane Layout) to make. Circuit arrangement (Layout), and then define the matrix (Matrix) arrangement, and then provide the manufacturer to fill in the code of each key position in the chip; this production method can reduce the circuit board printing process, reduce production costs, and increase production. Relatively, the production steps are also reduced, thereby reducing the loss caused by the defect rate, and at the same time, it can also avoid the micro-short circuit caused by the free circuit of the jumper part, which can improve the ...

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Abstract

The present invention relates to a method for making film circuit board. Under the condition of having no wire jumper and preventing production of unknown key signal it adopts the following steps: making key position circuit and matrix arrangement, then when the film circuit board is made, firstly making PET heating preshrinking process of film circuit board, then printing circuit silver slurry on the film circuit board, then printing insulating layer or printing carbon layer on the printed circuit silver slurry, folding the film circuit board and making ultrasonic combination, punching structure holes on the film circuit board so as to obtain the product.

Description

technical field [0001] The invention relates to a manufacturing method of a thin-film circuit board, in particular to a method for arranging a key position circuit and matrix (Matrix) without jumping wires and avoiding the generation of unknown key signals, and then performing thin film according to the arranged key position and matrix. Method for making circuit boards. Background technique [0002] It is known that the keyboards used in notebook computers currently on the market also include a thin film circuit board (Membrane) in addition to the upper keys, the substrate, and the bridging bridge. When making this thin film circuit board, the manufacturer will first define and shape the button position layout, and then hand over the defined and shaped button position layout to the manufacturer for the matrix arrangement of the buttons (such as figure 1 shown), after the matrix arrangement of key positions, fill in the position code of each key in the chip. [0003] After ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/12
Inventor 吕添敏
Owner ZIPPY TECH
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