Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stripping film and its mfg. method

A technology of peeling film and peeling layer, which is applied in the direction of capacitor manufacturing, chemical instruments and methods, electrical components, etc., and can solve problems such as short circuit and height increase

Inactive Publication Date: 2004-10-06
TDK CORPARATION
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufactured product, the possibility of defects such as short circuit will increase

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stripping film and its mfg. method
  • Stripping film and its mfg. method
  • Stripping film and its mfg. method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4 and comparative example 1～3

[0036]

[0037] To a mixture of polydimethylsiloxane having a vinyl group and a hydrogenated diene silane compound, a platinum-based catalyst is added to carry out an addition reaction, and the addition reaction-type hardened silicone resin (Shin-Etsu Chemical Co., Ltd.) manufactured, KS-847H) were dissolved in various organic solvents shown in the following Table 1 to prepare silicone resin coatings with a total solid content concentration of 3.0% as release coat coatings. The compounding quantity of each material is as follows.

[0038] Hardening silicone resin KS-847H 300g

[0039] (Manufactured by Shin-Etsu Chemical Co., Ltd., 90 g of resin with a solid content concentration of 30%)

[0040] Platinum catalyst CAT-PL-50T (manufactured by Shin-Etsu Chemical Co., Ltd.) 3.0 g

[0041] Organic solvent 2700g

[0042] Using a bar applicator, apply the obtained silicone resin coating on a 38 μm thick biaxially stretched polyethylene terephthalate (PET) film as a base material...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Surface tensionaaaaaaaaaa
Login to View More

Abstract

A stripping membrane for preparing the ceramic substrate of printed circuit by coating ceramic paint on it and then stripping the ceramic paint layer from it, and its preparing process are disclosed. The obtained ceramic substrate has high size and shape precision. Said stripping membrane is prepared through coating it on at least one surface of basic membrane in such manner that there are two non-coated ends on said basic membrane and coating the oily ink on said stripping membrane and said non-coated ends.

Description

technical field [0001] The present invention relates to a release film and a method for producing the same, and more particularly to a release film for producing a laminated ceramic capacitor and a method for producing the same. technical background [0002] When manufacturing ceramic electronic components such as capacitors, piezoelectric components, positive thermistors, negative thermistors, or varistors, for example, ceramic coatings containing ceramic powder, organic binders, plasticizers, solvents, etc., are used It is coated on a flexible support by the doctor blade method to form a printed circuit board (dielectric layer), on which electrodes such as palladium, silver, and nickel are formed by screen printing. In the manufacturing process, when obtaining a laminated structure, each printed circuit board obtained is laminated to form a desired laminated structure, and a ceramic printed circuit board is obtained through a punching and cutting process. The binder in th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B32B7/02B32B18/00H01G4/30H01G13/00
Inventor 饭田修治宫原裕之高桥丰川崎薰
Owner TDK CORPARATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com