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Pins of outputting high current

A technology of pins and circuit boards, applied in the direction of circuits, printed circuits, conductive connections, etc., can solve problems such as difficult electrical connections of pins

Inactive Publication Date: 2004-10-27
ASTEC INT LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, during the soldering stage, the flow of solder 309 between each pin and the PCB is blocked, making it difficult to provide a good electrical connection between the pins 300 and the PCB

Method used

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  • Pins of outputting high current
  • Pins of outputting high current
  • Pins of outputting high current

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Embodiment Construction

[0032] For ease of description, the present invention is described below in terms of pins for connecting a DC-DC power converter to a PCB. In general, the present invention provides an apparatus for connecting two printed wiring boards in a near-parallel configuration.

[0033] The invention will be described in more detail with reference to the accompanying drawings. specifically, Figure 4 is a cross-sectional view of a terminal pin 400 according to the present invention; Figure 5 is a cross-sectional view of the module 510, the module 510 has a circuit board 511 connected to the PCB 520 by the pin 400 at a distance S; Figure 6 yes Figure 5 Detailed cutaway view of terminal pins, module and PCB. Such as Figure 4 As shown, the pin 400 has an elongated shape, including a first end portion 401 , an elongated portion 403 , and a second end portion 405 . The pin 400 provides electrical conductivity between the module 510 and the PCB 520 and is preferably a metal with hi...

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PUM

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Abstract

The terminal pins are utilized between DC / DC power source conversion module or similar module and PCB. Diameter in most length of pin is larger than the diameter of pin between module and PCB. The said structure improves current carrying capacity, and increases heat flow from power source conversion module to PCB. Smaller diameter is in favor of flowing of soldering tin. Thus, interval distance between module and PCB can be kept by interval part.

Description

technical field [0001] The present invention relates to a lead for connecting a printed circuit board with another printed circuit board, and more particularly to a lead with improved current-carrying capacity and heat conduction capacity. Background of the invention [0002] Electronic devices are often assembled from components consisting of electronic components on a printed circuit board (PCB), which are powered and communicate over a common bus. In some use cases of this structure, power is delivered via the bus to individual boards at a voltage that can be used directly by loads on those boards. Recent trends in electronics architecture include the use of higher voltage buses combined with board-level DC-DC power conversion. Thus, for example, a bus operating at 48V can deliver power to a power converter on a circuit board that has a lower output voltage, such as 3.5V, for use by devices on the board. The implementation of structures with higher voltage buses is faci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R12/51H05K1/14H05K3/34H05K3/36H05K7/14
CPCH05K2201/10871H01R9/091H05K3/368H05K3/3447H01R12/523H05K2201/10303H05K7/1432H05K1/141H05K7/14329
Inventor 卡尔·T·弗朗克
Owner ASTEC INT LTD