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Method for removing edge coated on substrate and coating said substrate, and the substrate thereof

A substrate and coating technology, which is applied in photolithographic exposure devices, packaging, household packaging, etc., can solve problems such as damage to the photoresist layer, sensitivity, dark removal, adverse effects of adhesion, and pollution of the photoresist layer

Inactive Publication Date: 2004-12-01
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0015] However, with this method, there is a danger that the photoresist layer will be contaminated by splashes at the locations required for subsequent processing stages, or that the photoresist layer can absorb solvent fumes, which can cause problems such as sensitivity, dark Detrimental effects on the functional properties of removability and adhesiveness
Due to the relative insolubility of some photoresists, they cannot be removed without leaving traces using this method
In the prior art, in addition to solvents and / or etching media, mechanical cleaning methods such as brushing are often used, which can additionally damage the photoresist layer

Method used

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  • Method for removing edge coated on substrate and coating said substrate, and the substrate thereof
  • Method for removing edge coated on substrate and coating said substrate, and the substrate thereof
  • Method for removing edge coated on substrate and coating said substrate, and the substrate thereof

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Embodiment Construction

[0038] figure 1 A schematic cross-sectional view and a top view of a device (hereinafter) 1a according to a first embodiment of the invention are shown. The device 1a comprises a holding member 5 on which the substrate 2 is held. The holding member 5 may, for example, be a vacuum device (vacuum chuck). As indicated by the arrow, the holding member is rotatable about the axis of rotation 6 . The holding member 5 may be designed for spin-coating the photoresist layer on the substrate 2, ie designed for relatively fast spin speeds. The holding member 5 can also be designed as a holding element in a robot arm or in a production line for semiconductor manufacturing.

[0039] Layer 3 is applied on substrate 2 . Such as figure 1 It is shown schematically that the edge region 4 of the layer 3 is thickened. The term "edge region" as used in this patent always refers to the region of the substrate surface and / or the front side of the peripheral edge of the substrate 2 and / or the r...

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Abstract

The invention relates to a method and an apparatus for removing an edge region of a layer applied to a substrate and for coating a substrate, in particular, with a photoresist layer. Furthermore, the present invention relates to a substrate, onto which a layer, in particular, a photoresist layer for use in a microlithographic process, is applied, wherein an edge region of the layer is removed according to the invention. In the method, a laser beam is imaged onto the edge region, and the edge region is removed by the laser beam. In this manner, the edge region can be removed reliably and precisely, without damage to or contamination of regions of the layer which are not to be removed.

Description

[0001] This application claims priority from German Patent Application No. 103 18 681.6, which is expressly incorporated herein by reference in its entirety. technical field [0002] The invention relates to a method and a device for removing edge regions of layers applied to a substrate and for coating a substrate, especially with a photoresist layer. Furthermore, the invention relates to a substrate on which a layer, in particular a photoresist layer for use in microlithographic processing, is applied, the edge regions of which are removed according to the invention. Background technique [0003] In the process of coating substrates, such as wafers, mask blanks, photomasks or substrates used in LCD displays, the peripheral area and edges of the substrate are also coated. However, coating of these areas is undesirable because contact with handling tools (such as vacuum holding equipment) tends to cause abrasion (which can contaminate the substrate). These problems are beco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/40G03F7/20H01L21/027
CPCB23K26/0823B23K2201/40B23K26/0807B23K26/0853B23K26/0656B23K26/362B23K26/4075G03F7/2028B23K26/0738B23K26/409B23K26/40B23K26/066B23K26/082B23K26/361B23K2101/40B23K2103/172B23K2103/50A45D33/006A45D2033/001B65D43/16
Inventor H·瓦格纳D-P·B·拜尔D-I·M·席费勒G·黑贝尔P·鲁达科夫B·霍策尔
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