Low melting point rare earth oxide reinforced composite leadless solder butter

Abstract

A low-smelting-point RE oxide reinforced lead-free composite solder paste for soldering electronic elements is prepared through mixing RE oxide with solder, stirring, adding lead-free metallic powder, and mechanical mixing. Its advantages are excellent mechanical performance, electric conductivity and structure stability.

Description

technical field [0001] The invention belongs to the field of metal materials, relates to the technical field of soldering materials for electronic packaging, and in particular relates to a lead-free solder paste suitable for soldering electronic components and requiring high reliability packaging and a preparation process thereof. Background technique [0002] Traditional tin-lead (SnPb) solder has been used for thousands of years and has now become the main material for electronic package interconnection. However, lead and its compounds are highly toxic substances, which bring great harm to the living environment and safety of human beings. [0003] Constrained and driven by factors such as public opinion, environmental awareness, and market demand, lead-free electronic packaging has become a major scientific and technological frontier issue and a systematic engineering issue in academia and industry. Since the U.S. anti-lead bill HR-5374 (U.S. Congress), S-2637 and S-391 ...

AI Technical Summary

Problems solved by technology

These studies have made some progress, but there are still many problems: the process performance of the composite solder is poor; the addition of the reinforcement af