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Plating machine and process for producing film carrier tapes for mounting electronic parts

A technology of electronic components and electroplating machines, applied in the direction of electrical components, electrolytic components, electric solid devices, etc., can solve problems such as coating failure, and achieve the effect of reducing the possibility

Inactive Publication Date: 2005-02-02
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In liquid level control coating, the outer leads to be coated usually have a width of several tens of micrometers (μm), at which level any slight change in the level of the plating solution due to attached air bubbles will cause coating failure

Method used

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  • Plating machine and process for producing film carrier tapes for mounting electronic parts
  • Plating machine and process for producing film carrier tapes for mounting electronic parts
  • Plating machine and process for producing film carrier tapes for mounting electronic parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0104] Polyimide long film (UPILEX) with average thickness 50 μm, width 48 mm and length 120 m  -S, available from UBE Industries Co., Ltd.) is perforated to produce a plurality of perforations near both edges in the width direction.

[0105] Thereafter, an electrodeposited copper foil having an average thickness of 25 μm was soldered to the polyimide film. The electrodeposited copper foil is then coated with a photosensitive resin, which is exposed and developed to form a resin pattern.

[0106] Subsequently, the electrodeposited copper foil is etched using the above-formed pattern as a mask material. Thus, a wiring pattern of copper is produced. The mask material (exposed resin pattern) is removed by alkaline cleaning.

[0107] The wiring pattern is then coated with a solder resist coating liquid in all surfaces except the areas corresponding to the inner and outer leads. The coating is then dried to produce a solder resist layer.

[0108] The strip with solder mask pr...

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Abstract

A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

Description

technical field [0001] The present invention relates to a plating machine for partially coating a film carrier tape for mounting electronic parts by immersing a selected portion of the film carrier tape for mounting electronic parts into a plating solution (liquid level control plating), and using This electroplating machine produces a method of film carrier tape for mounting electronic components. Background technique [0002] Electronic components are incorporated in a device using a film carrier tape composed of a flexible insulating film and a plurality of wiring patterns formed thereon. [0003] Such film carrier tapes for mounting electronic components include TAB (Tape Automated Attachment) tape, CSP (Chip Scale Package) tape, COF (Chip On Film) tape, BGA (Ball Grid Array) tape, ASIC (Application Specific Integrated Circuit) ) tapes, bimetallic (double-sided) tapes and tapes for multilayer interconnects. These film carrier tapes have inner leads for connection to te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60C25D17/00C25D21/04H01L21/48H01L23/498H05K1/00H05K3/24
CPCH05K2203/1545H01L2924/0002H01L23/4985H05K2203/1518H05K1/0393C25D17/001C25D17/00H05K3/241C25D21/04C25D5/003H01L21/4821H01L2924/00
Inventor 藤本明
Owner MITSUI MINING & SMELTING CO LTD
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