Substrate processing apparatus and method for adjusting a substrate transfer position

Abstract

To align a substrate with high accuracy for a short time in acquiring the data of a substrate delivery position to a substrate holding part beforehand with respect to a substrate conveying means conveying the substrate in and out of a processing unit performing predetermined processes to the substrate. With respect to a mark that is formed on the surface of a substrate for alignment delivered to a substrate holding part by a substrate conveying means, the positions of the marks are respectively imaged before and after the time when the substrate holding part is rotated 180[deg.], for example. After the misregistration between the positions of the center of the substrate and the rotational center of the substrate holding part is calculated on the basis of the positional data of this mark, the existence of the misregistration calculated by this means is decided. There is such a constitution that the substrate is rearranged to the substrate conveying means in such a manner that the center of the substrate coincides with the rotational center of the substrate holding part at the time when it is decided that there is misregistration.

Description

technical field [0001] The present invention relates to a substrate processing apparatus that acquires position data of a substrate transfer unit in advance when delivering a substrate to a processing unit for performing predetermined processing such as resist application, development, and heating on a substrate held on a substrate holding unit. , and a method for adjusting the transfer position of the substrate. Background technique [0002] Conventionally, in the photoresist process as one of the semiconductor manufacturing processes, for example, a resist is applied in a thin film on the surface of a semiconductor wafer (hereinafter referred to as wafer), and the resist is exposed in a predetermined pattern. After that, development is performed to form a predetermined mask pattern. Generally, such a treatment is performed by using a substrate processing apparatus in which an exposure apparatus is connected to an application / development apparatus for applying and developi...

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Problems solved by technology

[0008] However, in the above-mentioned teaching, it is not economical to provide sensors 21 for all the units of the substrate processing apparatus, so the actual situation is that the operator uses the common sensor 21 to adjust the target processing unit when performing the teaching.

In particular, in the above-mentioned coating / developing device in which a plurality of processing units are assembled, each processing unit is miniaturized in order to reduce the occupied area of ​​the device, so the operator adjusts the sensor 21 in the unit while performing axis alignment. time consuming problem

[0009] In addition, in the case of using the light reflective sensor 21, the sensitivity of the sensor 21 may vary due to the surrounding atmosphere such as dust or illuminance, so there is a concern that the edge of the wafer W cannot be detected with high accuracy.

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