High-density chip scale package and method of manufacturing the same

A chip-size packaging and high-density technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as limiting the scope of application
CN1577815AInactive Publication Date: 2005-02-09SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Publication Date
2005-02-09
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

Disclosed herein is a high-density chip scale package which is capable of increasing circuit density and expanding a circuit-formable zone. The high-density chip scale package comprises a die having a circuit pattern formed thereon, and a printed circuit board adapted for mounting the die thereon. The printed circuit board has an area 100% to 150% as large as an area of the die, and the printed circuit board has a circuit pattern formed thereon. On the die is mounted a heat sink for radiating heat from the die. Between the printed circuit board and the heat sink is filled an encapsulant for securely connecting the printed circuit board and the heat sink and shielding the printed circuit board from the outside.
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Description

technical field

[0001] The present invention relates to high-density chip-scale packages capable of increasing circuit density and expanding the area where circuits can be formed, and more particularly to high-density packages that do not require the preparation of cavities and the use of liquid encapsulants in conventional techniques when heat sinks are attached to packages. Chip size packaging, in order to increase circuit density, expand the formable circuit area, enhance the heat radiation efficiency of the heat sink, and can be applied to any kind of chip mounted by wire bonding and flip chip technology. Background technique

[0002] As known to those skilled in the art, as the electronics industry is highly developed, electronic devices become smaller while they have increased capacity. Advances in IC chips inevitably lead to an increase in the number of I / O (input / output) of semiconductors. When the number of I / Os of semiconductors increases, a large amount of heat i...

Claims

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