Manufacturing method of ceramic raw sheet and manufacturing method of electronic member using the ceramic raw sheet
A manufacturing method, technology of ceramic green sheets, applied to printed circuit parts, fixed capacitance parts, exposure method of radiation-sensitive masks, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 example
[0034] As the general description of the above-mentioned embodiments, in the exposure process, by using a simple light source and a mask, the method of exposing each area with a different luminous flux includes: using a simple light source and a mask, using a method with sufficient intensity A method of patterning a pattern with light such as a laser, and a method of forming a pattern using an area light source in which a plurality of light sources are arranged. However, the most commonly used and considered the most reliable method is the method using a mask. Therefore, an example of a method using a mask will be described.
[0035] figure 1 A layer forming method according to a first embodiment of the present invention is shown. figure 1 Sectional views of the layer or green sheet structure in the thickness direction at different stages of the process are shown. In this embodiment, a photosensitive material 3 including a powder having desired electrical properties is form...
no. 2 example
[0044] figure 2 and figure 1 Similarly, cross-sectional views of the layer or green sheet structure in the thickness direction are shown at different stages of the process. The other figures to be mentioned below should also show cross-sectional views of the green sheet structure at different stages of the process. This embodiment refers to the case where a via hole is formed in the insulating layer 4 . More specifically, a photosensitive material 3 is formed on a base member 2 made of a PET film (step 1). Next, in step 2, the mask 15 in which desired electrode patterns 15b and via hole patterns 15c are respectively formed is placed in close contact with the back of the base member 2, and ultraviolet light is applied from the back of the mask.
[0045] In this method, the exposure amount is controlled so that the thickness of the cured portion of the photosensitive material 3 is t1. The transmittance of ultraviolet light of the pattern 15b is designed to be about half of ...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More